Wire cutting device and method for polycrystalline silicon

Abstract

The invention discloses a wire cutting device and method for polycrystalline silicon. The wire cutting device for the polycrystalline silicon comprises a base, a material bearing device, a rack and a wire cutting apparatus. The material bearing device is arranged on the base and provided with a first-station platform and a second-station platform in a rotating mode through a rotating mechanism, the first-station platform and the second-station platform rotate along the same circumference in a vertical plane and are located at the two ends of the same diameter of the circumference, and the first-station platform and the second-station platform rotate are both provided with a plurality of bearing plates used for bearing the polycrystalline silicon to be cut. The rack is arranged on the base and is close to the material bearing device. The wire cutting apparatus is arranged on the rack and arranged above a material conveying device in a liftable mode through a lifting mechanism and comprises a plurality of wire cutting units used for cutting the polycrystalline silicon to be cut. The wire cutting device and method for the polycrystalline silicon have the advantages that the structure is simple, operation is convenient, cutting precision is high, and cutting efficiency is high.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a polysilicon wire cutting equipment and method. Background technique [0002] Wire cutting technology is a relatively advanced square extraction processing technology in the world at present. Its principle is to rub the workpiece (such as silicon rod, sapphire, or other semiconductor hard and brittle materials) through high-speed moving diamond wire to cut out a square ingot. , so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable. Under the action of the pressure pump, the assembly The cooling water automatic spraying device on the equipment sprays the cooling water to the cutting part of the diamond wire and the workpiece, and the reciprocating motion of the diamond wire produc...

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Problems solved by technology

[0003] However, the current polysilicon wire cutting equipment still has deficiencies. For example, the current wire cutting equipment can only cut one object to be cut at a time.

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