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Preparation method of resin gel for producing copper-clad plate

A technology of resin glue and copper clad laminate, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve problems such as complex metallization process, low pass rate, poor adhesion between metal copper and hole wall

Inactive Publication Date: 2015-12-30
铜陵翔宇商贸有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-frequency copper-clad laminates currently on sale at home and abroad are mainly based on polytetrafluoroethylene resin matrix, but the PTFE resin matrix has a big defect, that is, the metallization process in the hole is complicated when the circuit board is made, and the pass rate is low. The fatal defect is The metal copper has poor adhesion to the hole wall and is easy to fall off, which leads to disconnection of the line in the hole

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Preparation method of resin glue for producing copper clad laminates, including toluene, allyl bisphenol A, polyphenylene ether, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, decabromo Diphenylethane, the proportion of each component by weight is:

[0013] 300:1.5:90:2.32:17.42:49.9:15.6;

[0014] First dissolve polyphenylene ether and benzoyl peroxide with toluene, after mixing, add allyl bisphenol A; after the temperature of the solution is raised to 100°C, keep it warm for one hour; then add dicumyl peroxide and triene Propyl cyanate, keep the temperature at 100°C, and continue to react for 1 hour; immediately cool the resin temperature to below 70°C after the reaction time is completed; finally add the composite flame retardant decabromodiphenylethane, stir evenly, and then prepare of the resin glue.

[0015] Resin control index: gelation time: 125±15 seconds

[0016] Viscosity: 21±4 seconds

[0017] Solid content: 51±3%.

Embodiment 2

[0019] Preparation method of resin glue for producing copper clad laminates, including toluene, allyl bisphenol A, polyphenylene ether, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, decabromo Diphenylethane, the proportion of each component by weight is:

[0020] 320:1.5:95:2.32:17.5:51:15.8;

[0021] First dissolve polyphenylene ether and benzoyl peroxide with toluene, after mixing, add allyl bisphenol A; after the temperature of the solution is raised to 100°C, keep it warm for one hour; then add dicumyl peroxide and triene Propyl cyanate, keep the temperature at 100°C, and continue to react for 1 hour; immediately cool the resin temperature to below 70°C after the reaction time is completed; finally add the composite flame retardant decabromodiphenylethane, stir evenly, and then prepare of the resin glue.

[0022] Resin control index: gelation time: 125±15 seconds

[0023] Viscosity: 21±4 seconds

[0024] Solid content: 51±3%.

Embodiment 3

[0026] Preparation method of resin glue for producing copper clad laminates, including toluene, allyl bisphenol A, polyphenylene ether, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, decabromo Diphenylethane, the proportion of each component by weight is:

[0027] 310:1.5:92:2.32:17.46:50:15.65;

[0028] First dissolve polyphenylene ether and benzoyl peroxide with toluene, after mixing, add allyl bisphenol A; after the temperature of the solution is raised to 100°C, keep it warm for one hour; then add dicumyl peroxide and triene Propyl cyanate, keep the temperature at 100°C, and continue to react for 1 hour; immediately cool the resin temperature to below 70°C after the reaction time is completed; finally add the composite flame retardant decabromodiphenylethane, stir evenly, and then prepare of the resin glue.

[0029] Resin control index: gelation time: 125±15 seconds

[0030] Viscosity: 21±4 seconds

[0031] Solid content: 51±3%.

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Abstract

The invention discloses a preparation method of resin gel for producing a copper-clad plate. The method is characterized in that resin gel is prepared from methylbenzene, allyl bisphenol A, polyphenyl ether, benzoyl peroxide, trially cyanate ester, dicumyl peroxide and decabrominated dipheny ethane according to the weight ratio of 300-320 to 1.5 to 90-95 to 2.32 to 17.42-17.5 to 49.9-51 to 15.6-15.8. Polyphenyl ether resin is thermoplastic resin and has quite high glass conversion temperature (260 DEG C), the thermal resistance of polyphenyl ether resin is equivalent to that of polyimide resin, and therefore it is ensured that polyphenyl ether resin can be applied in the severe environment with quite high thermal resistance requirement.

Description

technical field [0001] The invention relates to a method for preparing resin glue for producing copper-clad laminates, in particular to high-frequency microwave copper-clad laminates with a dielectric constant of 3.4. Background technique [0002] Dielectric constant 3.4 High frequency microwave copper clad laminate is the basic material and one of the necessary materials for high information transmission and communication. It is made of glass cloth prepreg impregnated with low dielectric constant resin polyphenylene ether and copper foil through high pressure and high temperature composite. High-performance, high-tech composite materials. [0003] Resin systems that can be used in the high-frequency communication field include polytetrafluoroethylene (PTFE), polyphenylene ether, and cyanate resin. The existing products at home and abroad are mainly PTFE and polyphenylene ether resin systems. The high-frequency copper-clad laminates currently on sale at home and abroad are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08K5/03C08F283/08B32B15/08
Inventor 沙以仙
Owner 铜陵翔宇商贸有限公司