Pressure sensing chip and processing method thereof

Abstract

The invention discloses a pressure sensing chip and a processing method thereof. The chip comprises an upper layer structure and a lower layer structure, wherein the lower layer structure comprises a lower layer substrate piece; MEMS parallel plate capacitors and an MEMS inductor which are connected in series are arranged on the lower layer substrate piece; the upper layer structure comprises upper layer substrate pieces, an MEMS pressure sensing film, an MEMS capacitor dielectric plate and a metal layer; the MEMS pressure sensing film is fixed on the upper layer substrate pieces, and placed above the lower layer substrate piece; the MEMS capacitor dielectric plate and the metal layer are fixed on the lower surface of the MEMS pressure sensing film; the MEMS capacitor dielectric plate is placed in between the two electrode plates of the capacitors; the metal layer is positioned above the MEMS inductor; the MEMS pressure sensing film is pressed to generate longitudinal displacement and drive the MEMS capacitor dielectric plate and the metal layer to move, so that the depth of the MEMS capacitor dielectric plate inserted into the MEMS parallel plate capacitors is changed and a magnetic gap between the metal layer and the MEMS inductor is also changed.

Description

technical field [0001] The invention relates to a pressure sensing chip, in particular to a passive wireless pressure sensing chip for the Internet of Things and a processing method thereof. Background technique [0002] The Internet of Things is called the third wave of the information industry after computers and the Internet, and it provides revolutionary information technology and intelligent technology for the global industrialization and urbanization process in the 21st century. As the basic underlying devices of the Internet of Things and the terminal nodes of the Internet of Things—sensors, will be the largest and most basic links in the entire Internet of Things industry chain. The technical level and development speed of the Internet of Things terminal nodes and related industries will directly affect The speed of development of the Internet of Things. [0003] Pressure sensor is the most commonly used sensor, which is widely used in various industrial self-contro...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a brand-new MEMS structure and signal transmission method to realize a suitable The passive wireless high-sensitivity MEMS pressure sensor chip used in the Internet of Things can wirelessly transmit the pressure signal to the receiving end without power supply

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