Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board

A rigid-flex board and gold finger technology, which is applied in the fields of coating non-metallic protective layer, reinforcement of conductive patterns, secondary treatment of printed circuit, etc., can solve the problem of difficult removal of residual glue of prepreg, internal pad or gold finger quality Abnormal, easy to be polluted sundries and other problems, to achieve the effect of reducing production scrap rate, increasing roughness, and improving quality

Inactive Publication Date: 2016-01-13
SHENZHEN SUNTAK MULTILAYER PCB
View PDF4 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that in the production process of the existing rigid-flex board, the inner layer gold fingers and pads are easily contaminated with debris after lamina

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0025] This embodiment provides a process for protecting gold fingers and pads inside a rigid-flex board, which includes the following steps:

[0026] S1. According to the predetermined size, cut the flexible board, rigid board and prepreg of the rigid-flex board respectively;

[0027] S2, the previous process, surface treatment is carried out on the flexible board and the rigid board, and then the inner layer circuit is made;

[0028] S3. Paste the covering film on the surface of the flexible board and perform the first fast pressing, so as to press the covering film more tightly on the surface of the flexible board;

[0029] S4. Carry out browning treatment on the gold finger area and pad area of ​​the flexible board to improve the surface roughness, then paste polyimide high temperature resistant tape on the gold finger area and pad area of ​​the flexible board, and carry out In the second rapid pressing, the size of one side of the polyimide high-temperature-resistant tap...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a process for protecting a goldfinger and a bonding pad in a rigid-flex printed circuit board. The process comprises the following steps of S1, respectively carrying out board cutting; S2, carrying out a front procedure; S3, coating the surface of a flexible board with a cover film and carrying out first rapid lamination; S4, coating the goldfinger and the bonding pad of the flexible board with a high-temperature resistant adhesive tape, and carrying out second rapid lamination; S5, carrying out brownification on a copper surface of the flexible board, carrying out lamination on the flexible board, a prepreg and a rigid board, and milling an appearance; S6, removing the high-temperature resistant adhesive tape, and carrying out nickel and gold deposition treatment on a goldfinger region and a bonding pad region which are exposed; and S7, carrying out a post procedure. By coating the high-temperature resistant adhesive tape, the problem that glue residue is remained on the prepreg on the goldfinger region and the bonding region, or the goldfinger and the bonding pad are polluted by other impurities during the lamination process and are difficult to clean is solved, normal surface treatment can be carried out on the goldfinger and the bonding pad after the high-temperature resistant adhesive tape is removed, no glue residue is remained, the production rejection rate is reduced, the product quality is improved, and the production cost is saved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and relates to a production process of a rigid-flex board, in particular to a process for protecting fingers and welding pads inside a rigid-flex board. Background technique [0002] With the continuous development of electronic technology, especially the continuous improvement of electronic assembly technology, traditional rigid printed circuit boards have gradually been unable to meet the requirements of "light, thin, short and small" electronic products, especially in military industry, medical equipment, mobile phones, The market demand for products such as cameras continues to expand, and the development and research of rigid-flex boards has received widespread attention. Rigid-flex board refers to a printed circuit board that contains one or more rigid areas and flexible areas at the same time. It is composed of rigid boards and flexible boards laminated together in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/28H05K3/24
CPCH05K3/28H05K3/24H05K2203/1383
Inventor 覃红秀何淼莫颢君
Owner SHENZHEN SUNTAK MULTILAYER PCB
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap