The invention discloses a process for protecting a goldfinger and a bonding pad in a rigid-flex printed circuit board. The process comprises the following steps of S1, respectively carrying out board cutting; S2, carrying out a front procedure; S3, coating the surface of a flexible board with a cover film and carrying out first rapid lamination; S4, coating the goldfinger and the bonding pad of the flexible board with a high-temperature resistant adhesive tape, and carrying out second rapid lamination; S5, carrying out brownification on a copper surface of the flexible board, carrying out lamination on the flexible board, a prepreg and a rigid board, and milling an appearance; S6, removing the high-temperature resistant adhesive tape, and carrying out nickel and gold deposition treatment on a goldfinger region and a bonding pad region which are exposed; and S7, carrying out a post procedure. By coating the high-temperature resistant adhesive tape, the problem that glue residue is remained on the prepreg on the goldfinger region and the bonding region, or the goldfinger and the bonding pad are polluted by other impurities during the lamination process and are difficult to clean is solved, normal surface treatment can be carried out on the goldfinger and the bonding pad after the high-temperature resistant adhesive tape is removed, no glue residue is remained, the production rejection rate is reduced, the product quality is improved, and the production cost is saved.