LED chip production technology

A LED chip and production process technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of discoloration of the appearance of the metal layer, generation of pinch marks, and peeling off of the metal layer to achieve the effect of eliminating electrostatic interference and preventing damage

Inactive Publication Date: 2016-01-27
ANHUI KEFA INFORMATION SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the chip cleaning is not clean enough and the evaporation system is abnormal, the evaporated metal layer (referring to the etched electrode) will fall off, the appearance of the metal layer will change color, and there will be abnormalities such as gold bubbles.
During the evaporation process, spring clips are sometimes used to fix the chip, so there will be clip marks (must be picked out in visual inspection)

Method used

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  • LED chip production technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A kind of LED chip production technology, it is characterized in that, its step comprises:

[0041] (1) cleaning

[0042] Ultrasonic cleaning is used to clean the LED bracket. The cleaning parameters are: ultrasonic vibration frequency 20,000 Hz, time 15 minutes, drying after cleaning, constant temperature drying, temperature 75°C, time 30 minutes;

[0043] (2) Expansion film

[0044] Expander is used to expand the film bonded to the chip, and the chip is preheated before expansion. The preheating temperature is 50°C, so that the distance between the LED chips is stretched to 0.55mm. The operating parameters of the expander are: working air pressure 4Kg / cm2, the temperature is 25°C, after the expansion is completed, the LED chip is solidified;

[0045] (3) spines

[0046] Place the LED chip on the jig of the piercing table, place the LED bracket under the jig, and stab the LED chip to the corresponding position one by one with a needle under the microscope;

[0047...

Embodiment 2

[0070] A kind of LED chip production technology, it is characterized in that, its step comprises:

[0071] (1) cleaning

[0072] Ultrasonic cleaning is used to clean the LED bracket. The cleaning parameters are: ultrasonic vibration frequency 20,000 Hz, time 25 minutes, drying after cleaning, constant temperature drying, temperature 75°C, time 30 minutes;

[0073] (2) Expansion film

[0074] Expander is used to expand the film of bonded chips, and the chip is preheated before expanding. The preheating temperature is 50°C, so that the distance between LED chips is stretched to 0.60mm. The operating parameters of the expander are: working air pressure 4Kg / cm2, the temperature is 30°C, after the expansion is completed, the LED chip is solidified;

[0075] (3) spines

[0076] Place the LED chip on the jig of the piercing table, place the LED bracket under the jig, and stab the LED chip to the corresponding position one by one with a needle under the microscope;

[0077] (4) d...

Embodiment 3

[0100] A kind of LED chip production technology, it is characterized in that, its step comprises:

[0101] (1) cleaning

[0102] Ultrasonic cleaning is used to clean the LED bracket. The cleaning parameters are: ultrasonic vibration frequency 20000 Hz, time 30 minutes, drying after cleaning, drying at constant temperature, temperature 75 ℃, time 30 minutes;

[0103] (2) Expansion film

[0104] Expander is used to expand the film of bonded chips, and the chip is preheated before expanding. The preheating temperature is 50°C, so that the distance between LED chips is stretched to 0.75mm. The operating parameters of the expander are: working air pressure 4Kg / cm2, the temperature is 45°C, after the expansion is completed, the LED chip is solidified;

[0105] (3) spines

[0106] Place the LED chip on the jig of the piercing table, place the LED bracket under the jig, and stab the LED chip to the corresponding position one by one with a needle under the microscope;

[0107] (4)...

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PUM

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Abstract

The invention discloses an LED chip production technology. During a machining process, constant temperature drying is employed and lasts for 30 minutes at the temperature of 75 DEG C. At this temperature, moisture on a support can be quickly evaporated, and the structure of the support can not be destroyed. Before chip expansion, a chip is pre-heated at the pre-heating temperature of 50 DEG C. The pre-heating enables the chip structure soft, and in the expansion process, the shape is easy to change. A wood vacuum suction nozzle is used to suck the LED chip up and move. The wood suction nozzle can prevent damage to the surface of the LED chip compared with the condition in which a steel nozzle may scratch a current diffusion layer on the chip surface. The pre-heating is carried out before the pressure welding at the temperature of 220 DEG C. Before the pressure welding, a welder is preheated so as to continuously keep the pressure welding temperature during the pressure welding process. Antistatic packages are employed for finished products. Circuit systems in the chips are easily interfered by the static so as to make the chips unstable, thus the antistatic packages can effectively prevent the static interference.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to an LED chip production process. Background technique [0002] The LED chip is a solid-state semiconductor device. The heart of the LED is a semiconductor wafer. One end of the wafer is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the entire wafer is encapsulated by epoxy resin. Also known as LED light-emitting chip, it is the core component of LED lights, which refers to the P-N junction. Its main function is to convert electrical energy into light energy, and the main material of the chip is monocrystalline silicon. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a P-N jun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62
CPCH01L33/62H01L2933/0066
Inventor 秦广龙蔡成凤文文发广旭孟成倪颖汪成凤杨全松
Owner ANHUI KEFA INFORMATION SCI & TECH
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