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Polyimide film

A polyimide film, p-phenylenediamine technology, applied in chemical instruments and methods, layered products, photovoltaic power generation, etc., can solve the problems of thermal expansion coefficient warpage, insufficient dimensional stability, etc., to reduce warpage , the effect of excellent dimensional stability

Active Publication Date: 2019-11-22
DUPONT TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these recent applications, silica and glass, which have a thermal expansion coefficient lower than that of copper, are often used. Conventional polyimide films may have insufficient dimensional stability or thermal expansion due to thermal expansion of MD and TD. Warping due to difference in coefficients
In addition, in conventional circuit board applications, fine pitches are required, and in such cases, conventional polyimide films have insufficient dimensional stability.

Method used

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  • Polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] DMAc 238.6g was added to a 500ml detachable flask, and PPD5.68g (0.053 moles), 4,4'-ODA 19.52g (0.098 moles), BPDA 11.03g (0.038 moles), PMDA 24.54g (0.113 mol), react at normal temperature and pressure for 1 hour, stir until uniform, and obtain a polyamic acid solution.

[0101] After taking 15 g from this polyamic-acid solution and cooling at -5 degreeC, 1.9 g of acetic anhydrides and 1.8 g of (beta)-picoline were mixed, and the liquid mixture was obtained.

[0102] The thus obtained mixed solution was cast on a drum at 90° C. for 30 seconds, and the obtained gel film was stretched 1.23 times in the moving direction while heating at 100° C. for 5 minutes. Next, while holding both ends in the width direction and heating at 270° C. for 2 minutes, it was stretched 1.4 times in the width direction, and then heated at 380° C. for 5 minutes to obtain a polyimide film with a thickness of 38 μm. Each characteristic was evaluated as shown in Table 1 after this polyimide film ...

Embodiment 2～3

[0104] According to the same steps as in Example 1, after making the aromatic diamine component and the aromatic tetracarboxylic anhydride component obtain the polyamic acid solution respectively in the ratio shown in Table 1, the stretching ratios in the transverse direction and the longitudinal direction are as shown in Table 1. Each characteristic of the polyimide film obtained by the operation similar to Example 1 was evaluated, and Table 1 shows the result.

[0105] Table 1

[0106]

[0107](In the table, the molar ratio represents the mole % in all aromatic diamine components and the mole % in all acid anhydride components, respectively)

[0108] From the results of Examples 1 to 3, it was confirmed that the polyimide film of the present invention is an isotropic film having a small dimensional change and a small difference in coefficient of thermal expansion between MD and TD.

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Abstract

The present invention relates to polyimide films. The purpose of the present invention is to reduce the dimensional change of the film, and the thermal expansion coefficient difference between MD and TD is small and isotropic, suitable for semiconductor package applications, semiconductor manufacturing process applications, display applications, solar cell substrates, fine pitch Polyimide film for applications requiring dimensional stability, such as circuit boards. A polyimide film obtained by using an aromatic diamine component containing p-phenylenediamine and an acid anhydride component, characterized in that TMA‑50 manufactured by Shimadzu Corporation is used in the measurement temperature range of 50 to 200 ° C, Coefficient of thermal expansion α in the mechanical transport direction (MD) of the film measured at a heating rate of 10°C / min MD and the thermal expansion coefficient α in the width direction (TD) TD Both are within the range of 0 ppm / °C or more and less than 7.0 ppm / °C, and satisfy |α MD ‑α TD |<3 relationship.

Description

technical field [0001] The present invention relates to a polyimide film excellent in dimensional stability and suitable for applications requiring dimensional stability, such as semiconductor package applications, semiconductor manufacturing process applications, display applications, solar cell substrates, and fine-pitch circuit substrates. Background technique [0002] Along with the high-definition of flexible printed circuit boards (FPC) and semiconductor packages, the requirements for polyimide films used in them have also increased. Examples include: reducing dimensional changes caused by bonding with metals and volume As the physical properties of polyimide film, it is required to have the same thermal expansion coefficient and high modulus of elasticity as metal, and it is also required to have a film with small dimensional change caused by water absorption. Polyimide film has been developed to meet this requirement. imine film. [0003] For example, there are know...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18B32B15/08B32B17/10
CPCY02E10/50C08J5/18C08L79/08C08G73/1046B32B15/20B32B17/1055C08L2203/16B32B2311/12B32B2379/08
Inventor 安田巨文山下伸介八并裕治小仓干弘
Owner DUPONT TORAY CO LTD