Manufacturing method of ultra-thin soaking plate employing heat sink materials as bottom plate

Abstract

The invention discloses a manufacturing method of an ultra-thin soaking plate employing ultrathin foamy copper as a wick, heat sink materials such as molybdenum-copper or tungsten-copper alloy as a bottom plate and an oxygen-free copper cover plate through processes of high-temperature sintering, copper silver or silver welding, packaged injection and the like. According to the method, integrated fabrication of the heat sink materials with high thermal conductivity and low expansion, such as the molybdenum-copper or tungsten-copper alloy and a conventional soaking plate is achieved; the ultrathin soaking plate which is 0.3mm to 2.0mm in thickness is manufactured; the ultrathin soaking plate is directly used for cooling chips of high-power or power electronic devices of a thyristor, an IGBT, an IGCT and the like; matching of thermal expansion coefficients of electronic components of the chips and the like and base materials of the heat sink materials is ensured; efficient and rapid heat conduction and cooling characteristics are achieved; the thermal resistance is reduced; the reliability of a system is improved; the method is convenient to manufacture, simple in equipment, free of pollution in a production process and suitable for bulk industrial production; and the structure of the manufactured soaking plate is a flexible structure which is thinned to about 0.3mm, and meets the requirements of uniform temperature, small thermal resistance and rapid and efficient cooling.

Description

technical field [0001] The invention relates to a manufacturing method of a vapor chamber. One of the characteristics of the vapor chamber is that its bottom plate adopts a heat sink material such as molybdenum copper or tungsten copper alloy, which realizes the integration of the heat sink material and the vapor chamber; features The second is to use ultra-thin copper foam, and at the same time, the internal structure layout of the vapor chamber, such as the position and structure of the steam chamber, is placed in the same layer structure of the liquid-absorbing core to prepare an ultra-thin vapor chamber. Background technique [0002] Thermal management is directly related to the stability and reliability of semiconductor electronic devices and major equipment work. At present, the design, manufacture and application of vapor chambers combined with device heat dissipation requirements are gradually being paid attention to, because vapor chambers have low thermal resistance...

AI Technical Summary

Problems solved by technology

Because the connection layer is added, it also causes structural changes, geometric dimensions and weight increases, which relatively reduces the reliability of the device

Because there is one more layer of connection, there is one more possibility of contact failure

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