A bias adaptive internal matching power amplifier tube and a power amplifier module based on the power amplifier tube
An internal matching, power amplifier tube technology, used in the fields of semiconductors, communications, and microelectronics, can solve problems such as the destruction of the best matching state of power amplifier modules, achieve good matching, make up for the impact, and solve the effect of reducing bandwidth
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Embodiment 1
[0036] Figure 2A , Figure 2B with Figure 2C They are respectively a top view, a cross-sectional view and a circuit diagram of the bias self-adaptive internal matching power amplifier tube provided by Embodiment 1 of the present invention.
[0037] Such as Figure 2A As shown, the power amplifier tube includes: a power chip 21, an internal matching capacitor 22 and a tube shell 23, and the tube shell 23 includes a tube shell base 231, a tube shell input terminal 232 and a tube shell output terminal 233, and the power amplifier tube may also include: a key wire 24 and capacitor bias terminal 25.
[0038] Such as Figure 2B As shown, ceramic materials 234 are disposed between the shell input end 232 , the shell output end 233 and the capacitor bias end 25 respectively. The power chip 21 includes a gate 211 , a source 213 and a drain 212 . The power chip 21 and the internal matching capacitor 22 are located on the package base 231 . The source 213 of the power chip 21 is...
Embodiment 2
[0058] Figure 7A , Figure 7B with Figure 7C They are respectively a top view, a cross-sectional view and a circuit diagram of the bias self-adaptive internal matching power amplifier tube provided by Embodiment 2 of the present invention.
[0059] In this embodiment, the upper electrode 221 of the inner matching capacitor 22 is the first electrode, and the lower electrode 222 of the inner matching capacitor 22 is the second electrode. Such as Figure 7A with Figure 7B As shown, the difference from Embodiment 1 of the present invention is that the second electrode 222 of the matching capacitor 22 in the tube of the power amplifier is electrically connected to the shell base 231 through the bonding wire 24, and the capacitance between the second electrode and the third electrode is directly connected to C2 short circuit, such as Figure 7C shown.
[0060] It should be noted that the power chip 21 in the power amplifier tube may be a laterally diffused metal oxide semic...
Embodiment 3
[0065] Figure 8 It is a cross-sectional view of the internal matching capacitor of the bias self-adaptive internal matching power amplifier tube provided by Embodiment 3 of the present invention. The difference from the power amplifier tube provided in Embodiment 1 or Embodiment 2 of the present invention is that the substrate 224 of the inner matching capacitor 22 of the power amplifier tube is provided with a through hole 226, and the side wall 227 of the through hole 226 is plated with metal. The capacitance between the second electrode 222 and the third electrode 225 is short-circuited.
[0066] In this embodiment, the number of through holes 226 is at least one, and the metal may be gold.
[0067] This structure communicates the second electrode 222 with the third electrode 225 through the through hole 226 . In actual application, the inner matching capacitor 22 is welded on the shell base 231 , so that the second electrode 222 of the inner matching capacitor 22 is ele...
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