Protective gas monitoring system used for copper wire bonding processing

Abstract

The invention discloses a protective gas monitoring system used for copper wire bonding processing. The protective gas monitoring system comprises a mixing tank, a hydrogen storage tank and a nitrogen storage tank. The hydrogen storage tank and the nitrogen storage tank are connected with an inlet of the mixing tank through conveying pipes. The protective gas monitoring system further comprises a DCS control system and a hydrogen analyzer. A pressure sensor, a pressure adjusting valve, a flow adjusting valve, a flow sensor and a flow meter are sequentially arranged on each conveying pipe. The pressure sensors and the flow sensors are connected with the signal input end of the DCS control system. The pressure adjusting valves, the flow adjusting valves and the flow meters are connected with the signal output end of the DCS control system. The collecting end of the hydrogen analyzer is connected with the mixing tank, and the output end of the hydrogen analyzer is connected with the signal input end of the DCS control system. The system can accurately monitor pressure, flow and a matching value of nitrogen and hydrogen protective gas needed in the copper wire bonding process, effectively increase the yield of products, and has the advantages of being accurate in detection, high in control response speed and sensitive in response.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a protective gas monitoring system for copper wire bonding processing. Background technique [0002] In recent years, in semiconductor packaging, because the copper wire process has a great cost advantage over the gold wire process, the copper wire process is currently a trend. In addition to the lower cost, the electrical conductivity of copper is higher than that of gold, and the thermal conductivity of copper is also higher than that of gold. Therefore, under the same diameter, copper wires can carry greater current, making copper wires not only usable In power devices, it can also be used in packages that require smaller diameter leads to accommodate high-density integrated circuits; the mechanical strength of copper is higher than that of gold, making it more suitable for bonding of thin leads. Although the cost of copper wire is low and the advantages are o...

AI Technical Summary

Problems solved by technology

However, since nitrogen and hydrogen protective gas is a high-risk gas, it is basically supplied from the periphery of the workshop

Since there is no special monitoring system, the pressure, flow rate and mixing ratio of the shielding gas are prone to deviations in actual operation, so that the added shielding gas cannot accurately meet the packaging work during copper wire bonding, which affects the quality of the product

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