Manufacturing method of cztse light absorbing layer based on simultaneous vacuum evaporation process
A light-absorbing layer and vacuum evaporation technology, which is applied in the fields of final product manufacturing, sustainable manufacturing/processing, photovoltaic power generation, etc., can solve problems such as process differences and low substrate temperature, achieve excellent film quality, solve Sn loss, and improve photoelectricity. The effect of conversion efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0039] First, a soda-lime glass substrate on which a molybdenum back electrode was vapor-deposited to a thickness of about 1 μm by a DC sputtering process was prepared.
[0040] The substrate formed with the back electrode is installed in a simultaneous vacuum evaporation device provided with Cu, Zn, Sn and Se evaporation sources, the substrate is heated, and the substrate temperature (T sub ) was maintained at 500°C, and the shutters of all the evaporation sources were opened for 60 minutes of evaporation. The evaporation temperature of each evaporation source used for vapor deposition was 1330°C for the Cu evaporation source, 360°C for the Zn evaporation source, 1360°C for the Sn evaporation source, and 140°C for the Se evaporation source.
[0041] Next, lower the temperature of the substrate with only the shutter of the Cu evaporation source closed, perform evaporation using the Zn, Sn, and Se evaporation sources, and close the shutters of all the evaporation sources when t...
Embodiment 2
[0044] Prepare the same glass substrate as in Example 1, install it in a simultaneous vacuum evaporation device provided with Cu, Zn, Sn and Se evaporation sources, heat the substrate, and maintain T sub In the state of =500°C, the shutters of all the evaporation sources were opened, and evaporation was performed for 40 minutes. The evaporation temperature of each evaporation source used for vapor deposition was 1320°C for the Cu evaporation source, 360°C for the Zn evaporation source, 1480°C for the Sn evaporation source, and 140°C for the Se evaporation source.
[0045] Next, lower the temperature of the substrate with the switches of the Cu evaporation source and the Zn evaporation source closed, perform evaporation using the Sn and Se evaporation sources, and turn off the switches of all the evaporation sources when the temperature of the substrate reaches 400°C was removed from the simultaneous vacuum evaporator when the temperature of the substrate became 70°C.
[0046]...
Embodiment 3
[0067] First, a soda-lime glass substrate on which a molybdenum back electrode was vapor-deposited to a thickness of about 1 μm by a DC sputtering process was prepared.
[0068] The substrate formed with the back electrode was installed in a simultaneous vacuum evaporation device provided with Cu, Zn, Sn and Se evaporation sources, and the substrate was heated to maintain T sub =500°C with the shutters of all the evaporation sources open for 15 minutes, and then with the shutter of the Cu evaporation source closed while maintaining the temperature of the substrate, use the Zn, Sn, and Se evaporation sources 25 minutes for evaporation. The evaporation temperature of each evaporation source used for vapor deposition was 1430°C for the Cu evaporation source, 360°C for the Zn evaporation source, 1420°C for the Sn evaporation source, and 140°C for the Se evaporation source.
[0069] Next, lower the temperature of the substrate while reopening the shutter of the Cu evaporation sour...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


