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Method for preparing high-performance metallic network transparent conducting electrode through metal plating method

A technology of transparent conductive electrodes and metal electroplating, which is applied to equipment for manufacturing conductive/semiconductive layers, cable/conductor manufacturing, circuits, etc., can solve the problem of large-area mass production of metal grid electrodes, high vacuum technology photoelectric Poor performance, increased electrode application cost and other issues, to achieve excellent light transmission, improve carrier collection efficiency, and improve electron collection efficiency

Active Publication Date: 2016-02-24
SOUTH CHINA NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there are some defects in the traditional metal grid electrodes
Generally metal grid electrodes require expensive preparation methods (screen printing, photolithography, vacuum deposition, etc.), which increases the application cost of this electrode
In addition, a large number of films are formed by vacuum deposition, which makes the large-area mass production of metal grid electrodes a difficult problem.
Recently, the random metal network electrode prepared by solution method or template method avoids expensive and complicated methods such as photolithography, but still requires high vacuum technology or poor photoelectric performance.

Method used

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  • Method for preparing high-performance metallic network transparent conducting electrode through metal plating method
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  • Method for preparing high-performance metallic network transparent conducting electrode through metal plating method

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Embodiment 1

[0037] The metal electroplating method that this embodiment provides prepares the method for high-performance metal network transparent conductive electrode, such as figure 1 , where (1) represents the preparation of a cracked sacrificial layer template on the substrate; (2) represents the deposition of a metal seed layer on the cracked sacrificial layer template; (3) represents the formation of a metal seed conductive layer network; (4) It means that the metal electroplating method is used to continue to deposit metal on the metal seed conductive network, and the metal network transparent conductive electrode with excellent photoelectric performance is prepared.

[0038] The detailed process of each step is as follows:

[0039] (1) Preparation of a cracked sacrificial layer template on the substrate

[0040] For the detailed process of preparing template liquid and forming a sacrificial layer template, please refer to the part of preparing a sacrificial layer template in the...

Embodiment 2

[0050] The metal electroplating method that this embodiment provides prepares the method for high-performance metal network transparent conductive electrode, such as figure 1 , where (1) represents the preparation of a cracked sacrificial layer template on the substrate; (2) represents the deposition of a metal seed layer on the cracked sacrificial layer template; (3) represents the formation of a metal seed conductive layer network; (4) It means that the metal electroplating method is used to continue to deposit metal on the metal seed conductive network, and the metal network transparent conductive electrode with excellent photoelectric performance is prepared.

[0051] The detailed process of each step is as follows:

[0052] (1) Preparation of a cracked sacrificial layer template on the substrate

[0053] For the detailed process of preparing template liquid and forming a sacrificial layer template, please refer to the part of preparing a sacrificial layer template in the...

Embodiment 3

[0062] The metal electroplating method that this embodiment provides prepares the method for high-performance metal network transparent conductive electrode, such as figure 1 , where (1) represents the preparation of a cracked sacrificial layer template on the substrate; (2) represents the deposition of a metal seed layer on the cracked sacrificial layer template; (3) represents the formation of a metal seed conductive layer network; (4) It means that the metal electroplating method is used to continue to grow metal on the metal seed conductive network, and the metal network transparent conductive electrode with excellent photoelectric performance is prepared.

[0063] The detailed process of each step is as follows:

[0064] (1) Preparation of a cracked sacrificial layer template on the substrate

[0065] For the detailed process of preparing template liquid and sacrificial layer template film formation, please refer to the part of preparing cracked templates in the inventio...

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Abstract

The invention discloses a method for preparing a high-performance metallic network transparent conducting electrode through a metal plating method. The method includes the following steps: (1) a fracturing sacrificial layer template is prepared on a substrate; (2) a metallic conducting seed layer is deposited on the fracturing sacrificial layer template; (3) the fracturing sacrificial layer is removed to form a metallic conducting seed layer network; and (4) metal is continuously deposited on the metallic conducting seed layer through the metal plating method, a continuous metal network with the larger thickness and the lower resistance is formed, and therefore the high-performance metallic network transparent conducting electrode is prepared. The transparent conducting electrode is mainly obtained through the metal plating method, the metal plating method belongs to a chemical liquid phase method, the preparing process is simple, resource consumption is low, and the high-performance metallic network transparent conducting electrode is suitable for large-area continuous preparation. The prepared transparent conducting electrode has the extremely-low surface resistance and the better light transmittance; meanwhile, the mechanical property and the environmental stability are good, the transparent conducting electrode is a beneficial replacer of a traditional metallic oxide electrode, and it is expected that the method is used for industrialization of the large-area transparent conducting electrode.

Description

technical field [0001] The invention belongs to the technical field of thin film electrodes, and in particular relates to a method for preparing a high-performance metal network transparent conductive electrode by a metal electroplating method. Background technique [0002] Transparent conductive electrodes are one of the key components of optoelectronic devices such as LEDs (light-emitting diodes), solar cells, and smart glasses. Generally speaking, a transparent conductive electrode means that the transmittance to the spectrum of the incident light wavelength range between 380nm and 780nm is greater than 80%, and the resistivity is lower than 10. -3 Ω·cm film electrode. Nowadays, conductive metal oxide films, such as ITO (indium-doped tin oxide) and FTO (fluorine-doped tin oxide), have been widely used in LEDs, solar cells and smart glass. From a physical point of view, the light transmission and conductivity of materials are a pair of basic contradictions. For a materi...

Claims

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Application Information

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IPC IPC(8): C25D5/54C25D5/56C25D3/46C25D3/38H01B13/00
CPCC25D3/38C25D3/46C25D5/54C25D5/56H01B13/0026
Inventor 高进伟彭强李松茹丁阳
Owner SOUTH CHINA NORMAL UNIVERSITY
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