LED (Light Emitting Diode) module with excellent radiating performance

Abstract

The invention discloses an LED (Light Emitting Diode) module with excellent radiating performance, which comprises a PCB (Printed Circuit Board) composite piece and a plastic piece, wherein the PCB composite piece comprises PCBs, a wire injection molding piece, a wire and LED constant current components; the wire injection molding piece is fixed with the PCBs by screws; the wire is fixed in the wire injection molding piece; the LED constant current components are welded on the PCBs; and the plastic piece and the PCB composite piece are integrally produced by an injection molding die. When the LED module with excellent radiating performance is energized, heat energy emitted by the LED constant current components and other electron components are rapidly conducted to the high thermal conductivity plastic piece, then heat conduction happens between the high thermal conductivity plastic piece and air or other heat conduction medium, and the junction temperature of the LED constant current components and other electron components can be kept at a very low level, so that the performance of the LED module is improved, the service life is prolonged, the carbon emission is reduced, and the environment-friendly value and economic value are high.

Description

technical field [0001] The invention relates to an LED module, in particular to an LED module with excellent heat dissipation performance, and belongs to the technical field of LED equipment. Background technique [0002] Like traditional light sources, semiconductor light-emitting diodes also generate heat during operation, and the amount depends on the overall luminous efficiency. Under the action of external electric energy, the radiative recombination of electrons and holes produces electroluminescence, which is radiated near the PN junction The light needs to go through the semiconductor medium of the chip itself and the packaging medium to reach the air. Considering the current injection efficiency, the quantum efficiency of radiation and luminescence, and the light extraction efficiency outside the chip, a considerable part of the energy is mainly generated by the lattice vibration of non-radiative recombination. The form is converted into heat, and the increase of th...

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Problems solved by technology

[0002] Like traditional light sources, semiconductor light-emitting diodes also generate heat during operation, and the amount depends on the overall luminous efficiency. Under the action of external electric energy, the radiative recombination of electrons and holes produces electroluminescence, which is radiated near the PN junction The light needs to go through the semiconductor medium of the chip itself and the packaging medium to reach the air. Considering the current injection efficiency, the quantum efficiency of radiation and luminescence, and the light extraction efficiency outside the chip, a considerable part of the energy is mainly generated by the lattice vibration of non-radiative recombination. The form is converted into heat, and the increase of the chip temperature will enhance the non-radiative recombination and further weaken the luminous efficiency; currently on the market, LEDs (light-emitting diodes) are usually arranged together according to certain rules and then packaged together, plus some waterproof treatment composition LED module, the existing LED module shell is divided into two structural forms, one is the integral structure, and the other is the upper and lower shell matching form, and the integral structure has good sealing performance, but its thermal conductivity is relatively poor. poor heat dissipation effect, which reduces the service life of the LED module; the split structure solves the above problems, but its sealing performance is difficult to be guaranteed

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