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Low-warpage and high-hardness polymer and preparation method thereof

A polymer and high-hardness technology, applied in the field of polymer materials, can solve the problems of low processing efficiency, many production processes, and increase the amortization cost of OEM factories, and achieve high hardness and wear resistance, excellent impact resistance, and preparation Methodologically Rigorous Effects

Inactive Publication Date: 2016-03-16
5ELEM HI TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]However, the unit price of magnesium alloy is expensive, the production process is many, and the processing efficiency is low
Problems faced by designers: 1) Cost control of thin and light design
The integrated CNC equipment formed by magnesium alloy is mostly the capital investment of the earliest Apple project. Mac and iPad occupy most of the production capacity. The new capital investment will increase the amortized cost of the OEM factory.

Method used

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Examples

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Embodiment Construction

[0026] The present invention will be further illustrated below in conjunction with specific embodiments, and it should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0027] The preparation method of the polymer with low warpage and high hardness described in the present invention comprises the following steps:

[0028] (1) Preparation of raw materials: It consists of the following components calculated by weight percentage:

[0029] POK resin 40-80%

[0030] Compatibilizer 0.1-2%

[0031] Processing aid 0.1-5%

[0032] Glass fiber 20-60%;

[0033] (2) Mixing: Mix POK resin, compatibilizer and processing aid in a high-mixer for 20-30 minutes;

[0034] (3) Extrusion: The mixture after step (2) enters the screw extruder from the main feeding port, the glass fiber is fed into the screw extruder from the side, and the flame retardant is fed into the screw...

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PUM

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Abstract

The invention discloses a low-warpage and high-hardness polymer. The low-warpage and high-hardness polymer is prepared from, by weigh, 40-80% of POK resin, 0.1-2% of compatilizer, 0.1-5% of processing aids and 20-60% of glass fibers. The steps of material preparation, mixing and extrusion are adopted. Material selection is scientific, the preparation method is precise; compared with conventional engineering plastic, the obtained polymer has more excellent impact resistance and chemical resistance and higher hardness and abrasion resistance, the hardness and the abrasion resistance are far higher than those of polymer POM (polyoxymethylene) which is the hardest at present, the warpage is low, and the low-warpage and high-hardness polymer is suitable for the occasions where the precision requirement is high.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a polymer with low warpage and high hardness and a preparation method thereof. Background technique [0002] In 2008, represented by Apple, the trend of ultra-thin consumer electronics began. Subsequently, touch smart phones, Pads, and finally Intel ultrabooks continued the design concept of light weight and ultra-thin. Apple has risen as a leading brand of consumer electronics, with a paranoid pursuit of consumer experience and excellence in product design. Apple has extensively used a new material, magnesium alloy, to achieve a lightweight and ultra-thin design. [0003] However, the unit price of magnesium alloy is expensive, the production process is many, and the processing efficiency is low. Problems faced by designers: 1) Cost control of thin and light design. While satisfying users' thin and light mobile experience, reducing costs and improving cost perfor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L73/00C08L51/00C08K13/04C08K7/14C08K5/526C08K5/134
CPCC08K5/134C08K5/526C08K7/14C08K13/04C08L51/00C08L73/00
Inventor 沙月华肖世英黄骥王东晖汪凯
Owner 5ELEM HI TECH CORP
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