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A method of manufacturing a coil plate

A manufacturing method and coil board technology, which is applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, and electrical connection formation of printed components, can solve the problems of high scrap rate, difficult etching, and reduced scrap rate, so as to improve production efficiency, The effect of reducing the difficulty of etching and reducing production costs

Inactive Publication Date: 2018-04-24
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems of high etching difficulty and high scrap rate when making coil boards with line spacing ≤ 3 mils in the existing method, and provides a coil board manufacturing method that can reduce etching difficulty and effectively reduce scrap rates, especially a coil board that does not require Manufacturing method of coil plate with high aspect ratio blind hole but with corresponding function of high aspect ratio blind hole

Method used

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Examples

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Embodiment

[0022] This embodiment provides a manufacturing method of a coil board, the circuit spacing of the coils on the coil board is 3mil, and the coil board is a 12-layer circuit board, including four inner layer core boards, two outer layer copper foils, one second outer copper foil and a third outer copper foil.

[0023] The specific production steps are as follows:

[0024] (1) inner line

[0025] The inner coil pattern on the film is transferred to the inner core board through the negative film process, and after etching and defilming treatment, the inner coil circuit is formed on the inner core board. The line width of the inner coil pattern is at least pre-larged by 0.009mm and the line spacing is ≥0.066mm; The side of the coil line and away from the center of the inner coil pattern is pre-larged by 0.02mm. Process the four inner layer core boards respectively to make inner layer circuits, and reserve them for later use.

[0026] (2) multi-layer board

[0027] According t...

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Abstract

The invention relates to the technical field of circuit board production, in particular to a manufacturing method for a coil plate. According to the method, when an outer coil circuit is made, the thickness of an outer copper foil is reduced first and the thickness of a copper layer formed by copper depositing and full-plate electroplating is strictly controlled to be 10-15 microns, so that the thickness of surface copper is enabled to be within a range of 18-25 microns, the adverse influence caused by shortage of circuit compensation space and circuit distance is reduced, the difficulty in etching is lowered, and the rejection rate of etching is reduced. One side of each of an innermost coil circuit and an outermost coil circuit of a coil pattern is pre-expanded by 0.02mm and available space is fully utilized to perform circuit compensation, so that the rejection rate of etching can be further reduced. By changing the structure and position of a metalized hole in the coil plate, the same function as a high-aspect-ratio blind hole is realized, so that the operation of forming the high-aspect-ratio blind hole in the coil plate is avoided, the difficulty in making the coil plate is lowered, the production efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a coil board. Background technique [0002] The circuit pattern is mainly based on winding, and the printed circuit board that replaces the traditional copper wire turns with etched lines is called a coil board. It is mainly used in inductive components and has a series of advantages such as measurement, high precision, good linearity, and simple structure. . However, in the prior art, it is difficult to manufacture a coil board with a line spacing of ≤3 mil. When the line spacing is ≤3 mil, due to insufficient space for line compensation, it is difficult to etch the line and the scrap rate is high. For HDI coil boards, that is, high-density interconnection boards whose circuit patterns are mainly wound, due to the large aspect ratio of blind holes in the board, it is more difficult to manufacture HDI coil boards with a line spacing of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46H05K3/42
CPCH05K1/185H05K3/00H05K3/429H05K3/4602H05K2201/10265
Inventor 韩启龙彭卫红刘克敢
Owner SHENZHEN SUNTAK MULTILAYER PCB