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Metal porous surface structure, preparation method thereof and inlay electroplating device

A surface structure, metal porous technology, applied in the field of composite material manufacturing, can solve the problems of high chemical energy consumption, complex process, easy to fall off, etc., to achieve the effect of stable surface preparation, ensuring uniformity and tight binding force

Active Publication Date: 2016-03-30
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, the methods of preparing porous surfaces are electrodeposition, dealloying or electrochemical corrosion, etc., but the porous surface prepared by these processes is unstable and easy to fall off, and the process is relatively complicated, the efficiency is low, and the chemical energy High consumption

Method used

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  • Metal porous surface structure, preparation method thereof and inlay electroplating device
  • Metal porous surface structure, preparation method thereof and inlay electroplating device
  • Metal porous surface structure, preparation method thereof and inlay electroplating device

Examples

Experimental program
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Effect test

Embodiment 1

[0046] Such as figure 1 As shown, a mosaic electroplating device for preparing a metal porous surface structure includes a DC power supply 1, an anode 2, metal powder particles 3, a cathode substrate 4, an electrolyte 5, a gauze 7 and an electrolytic cell 8; the cathode substrate 4 and the DC power supply 1 is connected to the negative pole, the anode 2 is connected to the positive pole of the DC power supply 1; the electrolyte 5, the cathode substrate 4 and the anode 2 are placed in the electroplating tank 8, the electrolyte 5 is immersed in the cathode substrate 4 and the anode 2, and the anode 2 is located on the cathode substrate 4 Above; the top surface of the cathode substrate 4 facing upwards is the inlaid electroplating base; the metal powder particles 3 are located on the inlaid electroplating base; the gauze 7 is pressed and fixed on the metal powder particles 3 to prevent the metal powder particles 3 from floating in the electrolyte 5;

[0047] The cathode substrate...

Embodiment 2

[0054] A method for preparing a metal porous surface structure, comprising the steps of:

[0055] (1) Pretreatment of cathode substrate and anode: In this embodiment, a red copper plate is selected as the cathode substrate, polished to Ra<0.2 μm, rinsed with alcohol and dried quickly; then use 120g / L NAOH solution and mass percentage Clean the cathode substrate separately with 5% HCL solution, and each cleaning time is 30s. When cleaning, the method of alkaline cleaning and then acid cleaning should be used; choose copper plate as the anode, and before electroplating, polish to remove the oxide layer, and use alcohol Rinse and dry quickly;

[0056] (2) Soak the spherical copper powder particles in CuSO 4 solution with H 2 SO 4 Solution configured electrolyte (wherein CuSO 4 0.4M,H 2 SO 4 1.5M), wet the copper powder particles, and then take out the copper powder particles and spread them evenly on the surface of the pretreated red copper cathode substrate, press and fix ...

Embodiment 3

[0060] Electroplating DC power supply current is 0.0002A / mm 2 , the electroplating time is 0.5h, and other steps are with embodiment 2; The porous surface structure that makes is as image 3 , the bonding force between copper powder is small, and the bonding force between copper powder and substrate is small. The structure is unstable, and the enhancement effect on heat transfer is weak.

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Abstract

The invention belongs to the technical field of composite manufacturing, and particularly relates to a metal porous surface structure, a preparation method thereof and an inlay electroplating device. On the basis of the inlay electroplating principle, wet metal powder particles are uniformly laid on the surface of a pre-processed cathode matrix, are tightly compressed by a gauze element and then are immersed in an electrolyte solution with the cathode matrix, the cathode matrix and a negative electrode of a direct current power supply, a positive electrode of the direct current power supply is connected with an anode, then electroplating is performed, the metal powder particles are bonded to the cathode matrix through electroplating, and the metal porous surface structure is obtained. A few working procedures are required, and the operation is simple. Besides, the invention provides an inlay electroplating device for preparing the metal porous surface structure. The device comprises the direct current power supply, the anode, the metal powder particles, the cathode matrix, the electrolyte solution, the gauze element and an electroplating bath. The prepared metal porous surface structure can be applied to the field of heat transmission.

Description

technical field [0001] The invention belongs to the technical field of composite material manufacturing, and in particular relates to a metal porous surface structure, a preparation method thereof, and an inlaid electroplating device. Background technique [0002] With the development of industrial technology, all walks of life have higher and higher requirements for material performance. In many cases, a single material is difficult to meet these requirements, so more and more people pay attention to the research of composite materials. [0003] Mosaic plating is one of the functional electroplating methods. This method can be used to obtain a composite coating, thereby changing the performance of the original material and meeting the required conditions. In previous studies, this method was mainly used to enhance the hardness, wear resistance, and high temperature resistance of materials. It is generally used to make cutting tools or special-shaped tools for hard material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25D15/00C25D17/00
CPCC25D5/00C25D15/00C25D17/00
Inventor 陆龙生高娇刘汉语刘小康汤勇
Owner SOUTH CHINA UNIV OF TECH