Metal porous surface structure, preparation method thereof and inlay electroplating device
A surface structure, metal porous technology, applied in the field of composite material manufacturing, can solve the problems of high chemical energy consumption, complex process, easy to fall off, etc., to achieve the effect of stable surface preparation, ensuring uniformity and tight binding force
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0046] Such as figure 1 As shown, a mosaic electroplating device for preparing a metal porous surface structure includes a DC power supply 1, an anode 2, metal powder particles 3, a cathode substrate 4, an electrolyte 5, a gauze 7 and an electrolytic cell 8; the cathode substrate 4 and the DC power supply 1 is connected to the negative pole, the anode 2 is connected to the positive pole of the DC power supply 1; the electrolyte 5, the cathode substrate 4 and the anode 2 are placed in the electroplating tank 8, the electrolyte 5 is immersed in the cathode substrate 4 and the anode 2, and the anode 2 is located on the cathode substrate 4 Above; the top surface of the cathode substrate 4 facing upwards is the inlaid electroplating base; the metal powder particles 3 are located on the inlaid electroplating base; the gauze 7 is pressed and fixed on the metal powder particles 3 to prevent the metal powder particles 3 from floating in the electrolyte 5;
[0047] The cathode substrate...
Embodiment 2
[0054] A method for preparing a metal porous surface structure, comprising the steps of:
[0055] (1) Pretreatment of cathode substrate and anode: In this embodiment, a red copper plate is selected as the cathode substrate, polished to Ra<0.2 μm, rinsed with alcohol and dried quickly; then use 120g / L NAOH solution and mass percentage Clean the cathode substrate separately with 5% HCL solution, and each cleaning time is 30s. When cleaning, the method of alkaline cleaning and then acid cleaning should be used; choose copper plate as the anode, and before electroplating, polish to remove the oxide layer, and use alcohol Rinse and dry quickly;
[0056] (2) Soak the spherical copper powder particles in CuSO 4 solution with H 2 SO 4 Solution configured electrolyte (wherein CuSO 4 0.4M,H 2 SO 4 1.5M), wet the copper powder particles, and then take out the copper powder particles and spread them evenly on the surface of the pretreated red copper cathode substrate, press and fix ...
Embodiment 3
[0060] Electroplating DC power supply current is 0.0002A / mm 2 , the electroplating time is 0.5h, and other steps are with embodiment 2; The porous surface structure that makes is as image 3 , the bonding force between copper powder is small, and the bonding force between copper powder and substrate is small. The structure is unstable, and the enhancement effect on heat transfer is weak.
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 