Three-dimensional-corrugated-graphene heat dissipating slurry, preparation method therefor and application of three-dimensional-corrugated-graphene heat dissipating slurry

Abstract

The invention discloses three-dimensional-corrugated-graphene heat dissipating slurry, a preparation method therefor and application of the three-dimensional-corrugated-graphene heat dissipating slurry. The preparation method comprises the steps: preparing porous graphene aggregates from laminar graphene through solvent action, carrying out heating, and then, carrying out sudden cooling, so as to obtain three-dimensional corrugated graphene blocks; crushing the three-dimensional corrugated graphene blocks, so as to obtain three-dimensional corrugated graphene; and compounding the three-dimensional corrugated graphene, a polymer and/or monomers of the polymer, thereby obtaining the heat dissipating slurry. According to the three-dimensional-corrugated-graphene heat dissipating slurry, the preparation method therefor and the application of the three-dimensional-corrugated-graphene heat dissipating slurry, the process is simple, and thus large-scale production is facilitated; in the three-dimensional-corrugated-graphene heat dissipating slurry, the three-dimensional corrugated graphene is adopted, so that the heat dissipating surface area of the composite material is increased, more heat conducting channels can exist in the vertical direction, and thus the heat dissipating efficiency is greatly increased; and the three-dimensional-corrugated-graphene heat dissipating slurry can be extensively applied to LED lighting and products, needing heat dissipation, of electric power, electronics, communication and the like.

Description

technical field [0001] The invention relates to a heat dissipation material and a preparation process thereof, in particular to a three-dimensional wrinkled graphene heat dissipation slurry and a preparation method thereof, belonging to the field of nanotechnology. Background technique [0002] With the trend of miniaturization and high integration of microelectronics technology, the operating frequency and power consumption of core devices such as chips and sensors have increased sharply, generating a lot of heat. In addition, the power of some power devices continues to increase, and the heat dissipation requirements for packaging are getting higher and higher. In the field of optoelectronic devices such as LEDs and lasers, poor heat conduction and heat dissipation will lead to an increase in the junction temperature of the device, thereby affecting efficiency and life. In consumer electronic products (batteries, mobile phones, etc.), due to the high energy storage and hi...

AI Technical Summary

Problems solved by technology

However, although the existing graphene heat dissipation film has a thermal conductivity that is difficult for other metals to match in the horizontal direction, its thermal conductivity in the vertical direction is very low, generally only 5-20W / mK, and can even be regarded as an insulating material. hot material

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