Standardized line data acquisition method
A collection method and line data technology, applied in data processing applications, electrical digital data processing, special data processing applications, etc., can solve the problem of lack of tower equipment information, effectively and quickly collect image information of designated towers, etc., to achieve low arc Vertical, improve the unit transmission capacity, the effect of less transmission loss
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Embodiment 1
[0050] The alloy wire is composed of the following weight percentages: Zr: 0.02%; Cu: 0.1%; Fe: 0.96%; Mn: 0.04%; vitrified bond: 0.1%; Mg: 0.05%; Ti: 0.02%; %; B: 0.2%, the balance is Al and unavoidable impurities. RE is Ce and La, where the mass ratio of Ce to La is 1:4.
[0051] The vitrified bond is composed of the following raw materials in weight percentage: 1% boron, 25% aluminum oxide, 5% lithium oxide, 3% sodium oxide and 4% magnesium oxide, 1% copper powder, 0.5% tin powder and 1% zinc oxide, the remainder The amount is silica; the particle size of said raw materials is not more than 10 microns.
Embodiment 2
[0053] The alloy wire is composed of the following weight percentages: Zr: 0.01%; Cu: 0.15%; Fe: 0.98%; Mn: 0.04%; Si: 0.1%; Mg: 0.06%; Ti: 0.05%; RE: 0.06%; B: 0.1%, the balance is Al and unavoidable impurities. RE is Ce, La, Nd and Ho, wherein the mass ratio of Ce, La, Nd and Ho is 1:1:2:1.
[0054] The vitrified bond is composed of the following raw materials in weight percentage: 2% boron, 20% aluminum oxide, 6% lithium oxide, 5% sodium oxide and 8% magnesium oxide, 2% copper powder, 1.5% tin powder and 0.3% zinc oxide, the rest The amount is silica; the particle size of said raw materials is not more than 10 microns.
Embodiment 3
[0056] The alloy wire is composed of the following components in weight percentage: Zr: 0.01%; Cu: 0.12%; Fe: 0.96%; Mn: 0.045%; Si: 0.1%; Mg: 0.09%; Ti: 0.01%; RE: 0.07%; B: 0.1%, the balance is Al and unavoidable impurities. RE is Ce, Nd and Ho, wherein the mass ratio of Ce, Nd and Ho is 1:2:2.
[0057] The vitrified bond is composed of the following raw materials in weight percentage: 1.5% boron, 22% aluminum oxide, 5% lithium oxide, 4% sodium oxide and 6% magnesium oxide, 1% copper powder, 1.0% tin powder and 0.5% zinc oxide, and the rest The amount is silica; the particle size of said raw materials is not more than 10 microns.
[0058] The electrical conductivity of the alloy wire is 65%, and the tensile strength exceeds 300MPa.
[0059] Carbon fiber composite wire is a new energy-saving capacity-enhancing wire with a new structure. Compared with conventional wires, it has light weight, high tensile strength, good heat resistance, small thermal expansion coefficient, sm...
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