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Highly-transparent room temperature deep curing type electronic pouring sealant

A technology of deep curing and potting glue, applied in the field of potting glue, can solve the problems of affecting the life of the lamp, limiting the development of the lamp, and low light output, and achieving the effect of improving mechanical tensile performance and light transmittance.

Inactive Publication Date: 2016-04-20
西卡(江苏)工业材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, high-power LED lamps, which are environmentally friendly and energy-saving green light sources, have developed rapidly. However, in practical applications, there are still problems of low heat dissipation and low light output rate. Heat dissipation affects the life of the lamp, and the light output rate limits the development of the lamp.

Method used

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  • Highly-transparent room temperature deep curing type electronic pouring sealant
  • Highly-transparent room temperature deep curing type electronic pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Component A is composed of a base material, a platinum complex with a pure platinum content of 1100ppm in a weight ratio of 100:0.01, and component B is composed of a base material, hydrogen-containing silicone oil with a hydrogen content of 0.9% and 1,4-butyne Diols are formed by mixing them in a weight ratio of 100:1.5:0.8. When using, mix the two components evenly according to the mass ratio of 1:1.

[0018] The aforementioned base material is obtained by high-speed shear dispersion mixing of 170g of divinyl silicone oil with a vinyl content of 0.25%, 17g of white carbon black and 70g of silicone resin solution, and then vacuum defoaming at 70°C for 3 hours.

[0019] The composition of the silicone resin solution is as follows:

[0020] 24g MQ silicone resin, containing 5% MDQ and 15% MTQ silicone resin in molar content, M / Q value 1.3, vinyl content 2%, ethanol 14g, toluene 30g.

Embodiment 2

[0022] Component A is composed of a base material, a platinum complex with a pure platinum content of 700ppm by weight ratio of 100:0.08, and component B is composed of a base material, hydrogen-containing silicone oil with a hydrogen content of 0.85% and isopropyl ether by weight It is composed of a mixture of 100:2.5:1. When using, mix the two components evenly according to the mass ratio of 1:1.

[0023] The aforementioned base material is obtained by high-speed shear dispersion mixing of 180g of divinyl silicone oil with a vinyl content of 0.9%, 18g of white carbon black and 78g of silicone resin solution, and then vacuum defoaming at 75°C for 3.5h.

[0024] The composition of the silicone resin solution is as follows:

[0025] MQ silicone resin 28g, containing 10% MDQ and 20% MTQ silicone resin in molar content, M / Q value 0.7, vinyl content 5%, ethanol 16g, toluene 31g.

Embodiment 3

[0027] Component A is composed of a base material, a platinum complex with a pure platinum content of 1400ppm mixed at a weight ratio of 100:0.05, and component B is composed of a base material, hydrogen-containing silicone oil with a hydrogen content of 0.7%, and diallyl maleate The esters are formed by mixing them in a weight ratio of 100:4:1.1. When using, mix the two components evenly according to the mass ratio of 1:1.

[0028] The aforementioned base material is obtained by dispersing and mixing 155g of divinyl silicone oil with a vinyl content of 2.3%, 15.5g of white carbon black and 65g of silicone resin solution at high speed shearing, and then vacuum defoaming at 80°C for 4 hours.

[0029] The composition of the silicone resin solution is as follows:

[0030] 15g MQ silicone resin, containing 10% MDQ and 20% MTQ silicone resin in molar content, M / Q value 1, vinyl content 2.2%, ethanol 22g, toluene 20g.

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Abstract

The invention discloses a highly-transparent room temperature deep curing type electronic pouring sealant. The highly-transparent room temperature deep curing type electronic pouring sealant is prepared from a component A and a component B, wherein the component A is prepared by mixing a base material and a platinum complex according to the weight part ratio of 100:(0.01 to 0.5); the component B is prepared by mxing a base material, a hydrogen-containing silicone oil and an inhibitor according to the weight part ratio of 100:(0.2 to 10):(0.01 to 5); the base material is prepared by shearing divinyl-based silicone oil, white black carbon and a silicon resin solution according to the weight ratio of 100:10:(10 to 50) at high speed, dispersing, mixing, and removing solvent by vacuum for 3 to 6h at the temperature of 70 to 100 DEG C; the inhibitor is propynol, 1,4-butynediol, alkynyl cyclohexanol, isopropyl ether, ethylene glycol monobutyl ether, octabromoether, diallyl maleate or diethyl fumarate; the silicon resin solution is an ethanol and methylbenzene mixed solution containing MQ silicon resin. The highly-transparent room temperature deep curing electronic pouring sealant has the characteristics that the strength is high, and the transparency is high.

Description

technical field [0001] The invention relates to a potting glue, in particular to a high-transparency room-temperature deep-curing electronic potting glue. Background technique [0002] There are many types of potting materials, mainly including: epoxy resin, silicone, polyurethane. There are many types of silicone potting adhesives. Different types of silicone potting adhesives have great differences in temperature resistance, waterproof performance, insulation performance, optical properties, adhesion to different materials, and hardness. Silicone materials can be added with some functional fillers to give them properties such as electrical conductivity, thermal conductivity, and magnetic conductivity. The mechanical strength of silicone potting adhesives is generally relatively poor. Two-group silicone potting adhesives are the most common. Such adhesives include: Condensation type and additive type. Generally, the condensation type has poor adhesion to components and po...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06
CPCC09J183/04C08L2205/025C08L2205/035C09J11/04C09J11/06C08L83/04C08K5/053C08K3/36
Inventor 李军明赵辉
Owner 西卡(江苏)工业材料有限公司