Wafer bonding method and wafer bonding structure
A wafer bonding and wafer technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of 3D integrated circuit failure, short circuit, etc., and achieve the effect of reducing the risk of short circuit
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[0031] As described in the background art, in the manufacturing process of 3D integrated circuits, after the wafer bonding process, short circuits between bonding ends are likely to occur, which affects the bonding quality.
[0032] Analyze the causes of short circuits between the bonded ends, and continue to refer to figure 1 As shown, since the distance between the first bonding ends 03 on the surface of the first wafer 01 is small, the distance between the second bonding ends 04 on the surface of the second wafer 02 is relatively small, so that the first bonding ends 03 Or the metal ions in the second bonding end 04 such as figure 1 As shown by the dotted line in the middle, diffusion is prone to occur, so that short-circuiting between adjacent first bonding ends 03 or between adjacent second bonding ends 04 is likely to occur.
[0033] In addition, the first bonding end 03 and the second bonding end 04 are usually made of copper. Copper exposed to the air is easily corroded by o...
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