Semiconductor device and method of polishing and cleaning wafer

Abstract

The invention provides a semiconductor device for polishing and cleaning a wafer, which comprises a front-end module, a measurement module, a CMP (Chemical Mechanical Planarization of Microelectronic Materials) polishing module and a cleaning module, wherein an EKC cleaning unit is arranged in the cleaning module for carrying out EKC solution cleaning processing on a wafer put in the cleaning module, and through slightly corroding the partial area on the surface of the wafer, pollution components which have a complex composition and are stubbornly attached to the surface of the wafer are removed jointly, and good effects of cleaning the wafer and improving the wafer yield are achieved. In addition, the invention also provides a wafer polishing and cleaning method. The method comprises a polishing step and a cleaning step. The cleaning step comprises four procedures of megasonic cleaning, Brush cleaning, EKC cleaning and IPA drying, thereby completing each conventional cleaning procedure for the traditional cleaning process, further improving the cleaning effects through the EKC cleaning procedure and facilitating improvement of the product yield.

Description

technical field [0001] The invention relates to the field of semiconductor processing and production, in particular to equipment and methods used in the chemical mechanical planarization process in the field of microelectronic devices. Background technique [0002] The semiconductor DRAM manufacturing process is divided into many steps, among which Chemical Mechanical Planarization of Microelectronic Materials (CMP) is used to remove various substances from the wafer surface. Conventional CMP methods use a polishing pad in rotational contact with a wafer to be planarized, while introducing a suitable CMP abrasive between the wafer and the polishing pad to facilitate material removal. CMP abrasives typically include abrasive slurries, among other things, various abrasive particles and oxidizing agents such as silica and alumina. [0003] With the advancement of technology, the application range of CMP technology has been widely broadened, and the technical means for CMP trea...

AI Technical Summary

Problems solved by technology

[0005] The present invention provides corresponding solutions to the above-mentioned technical problems, and relates to a semiconductor device and method for polishing and cleaning wafers. By adding EKC solution during the polishing and cleaning process to clean the wafers, it focuses on solving the problem of deposition on the wafers. The problem of large particles on the surface, thus avoiding the frequent occurrence of equipment abnormalities, and finally achieving the purpose of improving the yield of wafers

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