A micromechanical displacement sensor and its manufacturing method
A technology of displacement sensor and manufacturing method, which is applied to instruments, measuring devices, electric devices, etc., can solve the problems of friction and wear of wire-wound displacement sensors, difficulty in winding the insulating frame of resistance wire, and increasing the difficulty of processing, etc. Achieve automatic measurement, good consistency, and good contact results
Active Publication Date: 2018-05-25
SOUTHEAST UNIV
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Problems solved by technology
The wire-wound displacement sensor has disadvantages such as friction and wear, step error, low resolution and short life. At the same time, the resistance wire is not easy to be wound in the insulating skeleton in a small size, which increases the difficulty of processing.
The non-wound potentiometer displacement sensor is made of various thin film elements on an insulating substrate, with high resolution, long life, wear resistance and easy calibration, but the traditional non-wound potentiometer displacement sensor has a large volume
Method used
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[0031] The present invention will be further described below in conjunction with the accompanying drawings.
[0032] Micromechanical displacement sensor provided by the present invention, see figure 1 , the sensor includes a base substrate 1, a resistance wire 2, a first pad 21 and a second pad 22, a terminal block 3, a first fixed wall 41 and a second fixed wall 42, a contact electrode 5, a slider 6, Magnetic material 7, magnet 8, metal wire 9 and third pad 91;
[0033] The base substrate 1 includes a front side and a back side opposite to the front side;
[0034] The front of the base substrate 1 is divided into two regions, left and right,
[0035] The left area is provided with a first pad 21, a second pad 22 and a third pad 91, and a terminal stopper 3;
[0036] The right area is provided with a slider 6 and a first fixed wall 41 and a second fixed wall 42 for fixing the slider 6;
[0037] The slider 6 includes an upper frame, a lower frame and a connecting frame conn...
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The invention provides a micro-mechanical displacement sensor and a manufacturing method therefor. The sensor comprises a substrate (1), a resistor wire (2), a first bonding pad (21), a second bonding pad (22), a terminal baffle plate (3), a first fixed wall (41), a second fixed wall (42), a contact electrode (5), a sliding block (6), a magnetic material (7), a magnet (8), a metal conductor (9), and a third bonding pad (91). The substrate (1) comprises a front surface and a back surface opposite to the front surface. The front surface of the substrate (1) is divided into a left region and a right region, wherein the left region is provided with the first, second and third bonding pads (21, 22, 91). The substrate (1) is also provided with the terminal baffle plate (3). The sensor is small and exquisite in structure, is high in resolution, and is good in batch production consistency.
Description
technical field [0001] The invention relates to a micromechanical displacement sensor, which is a displacement sensor structure with moving parts manufactured based on micromachining technology. Background technique [0002] Displacement sensors are used in a variety of applications, such as engineering applications where position offsets and tolerances need to be established and maintained. The displacement sensor is also called a linear sensor, which converts the displacement into electricity, so as to realize the measurement of the displacement. Displacement sensors are divided into potentiometer type, self-inductance type, capacitive type, grating type and Hall effect and other types. Potentiometer displacement sensors are further divided into wire-wound potentiometer displacement sensors and non-wire-wound potentiometer displacement sensors. The wire-wound displacement sensor has disadvantages such as friction and wear, step error, low resolution and short life. At th...
Claims
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IPC IPC(8): G01B7/02
CPCG01B7/02
Inventor 秦明王庆贺穆林叶一舟高磬雅
Owner SOUTHEAST UNIV