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Epoxy resin composition with special curing characteristics and composite thereof

A technology of epoxy resin and curing characteristics, which is applied in the field of epoxy resin composition and its composite materials, can solve the problems of uneconomical, unfavorable for energy saving, consumption, etc., and achieve the goals of reducing usage, benefiting environmental protection, and reducing costs Effect

Inactive Publication Date: 2016-05-11
BAMSTONE NEW MATERIAL TECH (WUHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the first method is that it uses a large amount of solvent, which is neither economical nor environmentally friendly
The disadvantage of the second method is that the melting of the first heating will affect the solidification of the second heating, and the temperature of the two heatings must leave a sufficient interval
Moreover, the composition of the first state achieved after heating and melting is difficult to achieve the ideal low-viscosity state
At the same time, heating and cooling multiple times consumes more energy, which is not conducive to the requirement of energy saving

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Take 90 parts of E51 epoxy resin, add 10 parts of cyclohexanediol diglycidyl ether, stir evenly, then add 10 parts of phenol-blocked MDI, stir evenly, it is A component. Take 50 parts of monoethanolamine and 50 parts of diethanolamine, mix and stir evenly, and form B component. Take 100 parts of component A, add 8 parts of component B, mix and stir evenly to form a low-viscosity liquid, impregnate glass fiber cloth, cover the upper and lower sides with polyethylene film, wind up; place and mature for 2 days to form a prepreg. Take an appropriate amount of prepreg, tear off the upper and lower films, place it on a metal mold at 150°C, close the mold and hold the pressure for 5 minutes, open the mold, and take out the product.

Embodiment 2

[0054] Take 90 parts of E51 epoxy resin, add 10 parts of neopentyl glycol diglycidyl ether, stir evenly, then add 10 parts of phenol-blocked TDI, stir evenly, it is A component. The product of the addition reaction of ethylenediamine and acrylonitrile in a molar ratio of 1:2 is the B component. Take 100 parts of component A, add 10 parts of component B, add 200 parts of calcium carbonate, and 50 parts of chopped glass fiber, mix well, place and mature for 2 days to form a molding compound. Take an appropriate amount of molding compound, place it on a metal mold at 150°C, close the mold and hold the pressure for 5 minutes, open the mold, and take out the product.

Embodiment 3

[0056] Take 100 parts of E44 epoxy resin, add 10 parts of caprolactam-blocked MDI, 2 parts of ethyl acetate, stir well, and it is A component. The product of the addition reaction of hexamethylenediamine and acrylonitrile in a molar ratio of 1:2 is the B component. Take 100 parts of component A, add 8 parts of component B, mix and stir evenly to form a low-viscosity liquid, and paint on the surface of the steel plate. After standing for 2 days, take the asphalt and stone mixture at 180°C and apply it on the steel plate. After the asphalt is cooled, the epoxy resin composition can form an effective adhesive layer on the asphalt stone mixture.

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PUM

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Abstract

The invention discloses an epoxy resin composition with special curing characteristics and a composite thereof. The epoxy resin composition comprises, by mass, components A: 100 parts of epoxy resin, 0-50 parts of active dilutent, 1-50 parts of high-temperature crosslinking agent and 0-100 parts of solvent and a component B: low-temperature crosslinking agent, wherein the mass ratio of the components A to the component B is 100:1-100. Different reaction temperatures are utilized to control different reaction processes so as to realize conversion among forms of an epoxy resin mixture under different process requirements. The epoxy resin composition can be applied in the field of prepreg, adhesives, paint and molding materials. In addition, in the epoxy resin composition, consumption of the solvent is avoided or reduced, so that cost is lowered and environment protection is facilitated. The composite can be formed by adding filling and fibers on the basis of the epoxy resin composition.

Description

technical field [0001] The invention relates to an epoxy resin composition and its composite material, in particular to an epoxy resin composition with special curing properties and its composite material. Background technique [0002] For the curing of epoxy resin, various types of curing agents can generally be added to make the curing reaction have different characteristics. For example, adding an amine curing agent can cure the epoxy resin at low temperature (15-45°C); adding an acid anhydride curing agent can make the epoxy resin curing at a medium temperature (80-180°C). No matter it is cured at room temperature or cured at medium and high temperature, the curing degree of epoxy resin is gradually increased. [0003] In applications such as prepregs, molding compounds, certain coatings and adhesives, epoxy resins are expected to have the following process states: [0004] The first state: low-viscosity liquid state, convenient for coating, fiber infiltration and othe...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K7/14C08G59/64C08G59/22C08G59/24C08G59/56C08G18/80
Inventor 刘伟
Owner BAMSTONE NEW MATERIAL TECH (WUHAN) CO LTD
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