Epoxy resin composition for semiconductor encapsulation, semiconductor mounting structure and manufacturing method thereof
A technology of epoxy resin and manufacturing method, which is applied in the direction of epoxy resin coating, semiconductor devices, semiconductor/solid device components, etc., can solve the problems of large dimensional change and large thermal expansion rate, etc., to reduce warping and handleability excellent effect
Inactive Publication Date: 2018-01-16
NAGASE CHEMTEX CORPORATION
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- Application Information
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Problems solved by technology
On the other hand, when the semiconductor sealing material exceeds the glass transition temperature, the coefficient of thermal expansion becomes extremely large, and the dimensional change becomes large
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～5
[0085] "Examples 1-5, Comparative Examples 1-6"
[0086] The respective components shown in Table 1 were blended in respective blending amounts, and stirred sufficiently at normal temperature (25° C.) to prepare a uniform epoxy resin composition. Each of the obtained epoxy resin compositions was compression-molded on a silicon wafer with a diameter of 12 inches and a thickness of 300 μm on which a plurality of semiconductor chips of 5 mm square were mounted, to obtain a semiconductor package structure. Compression molding was performed at 110° C. for 10 minutes using a lower mold having a cavity having a diameter of 12 inches and a height of 0.4 mm, followed by post-curing at 170° C. for 120 minutes.
[0087]
[0088] For the epoxy resin compositions of Examples 1 to 5 and Comparative Examples 1 to 6, their cured products, or the semiconductor package structures sealed by the epoxy resin composition, and the singulated semiconductor packages obtained by singulating them Str...
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Abstract
The present invention provides an epoxy resin composition for semiconductor sealing, which comprises: (A) 100 parts by mass of epoxy resin, which contains 10 to 45 parts by mass of novolak type epoxy resin; (B) 50 to 150 parts by mass (C) 2 to 12 parts by mass of curing accelerator; (D) 5 to 50 parts by mass of silicone gel or silicone oil; and (E) fused silica with an average particle size of 2 to 30 μm. The content of (E) fused silica is 80-92% by mass, and the viscosity of the epoxy resin composition for semiconductor sealing is 1000 Pa·s or less at 25° C. and a shear rate of 2.5 s-1.
Description
technical field [0001] The present invention relates to an epoxy resin composition, and particularly to an epoxy resin composition suitable as a chip-on-wafer (CoW) type semiconductor sealing material. Background technique [0002] In recent years, along with progress in the miniaturization of electronic equipment, there has been an increasing demand for thinner and smaller semiconductor products. Therefore, packaging technology called wafer level chip size package (Wafer Level Chip Size Package), which mounts a plurality of semiconductor bare chips (bare chips) in the state of semiconductor wafers before singulation, and seals them, has attracted attention. . Thereafter, the laminate of the semiconductor sealing material and the semiconductor wafer can be singulated (diced) to obtain chip-level semiconductor products. Since such a semiconductor product has the same mounting area as the semiconductor bare chip, it is easier to miniaturize than the general method of mountin...
Claims
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IPC IPC(8): C08L63/00C08K3/36C08K5/00C08K5/09H01L23/29H01L23/31H01L25/065H01L25/07H01L25/18
CPCC08L63/00H01L24/94H01L24/97H01L25/0657H01L25/50H01L2224/0557H01L2224/14181H01L2224/16146H01L2224/32145H01L2224/73204H01L2224/92125H01L2224/94H01L2224/97H01L2924/3511H01L2225/06513H01L2225/06541H01L2225/06568H01L23/295H01L23/296C08K2201/003C09D163/00C08L2203/206C08G59/686C08K3/36C08L63/04C08L83/04H01L2224/81H01L2224/83H01L2224/16145H01L2924/00C08K5/09H01L23/293
Inventor 北川伟之藤井康仁菅克司
Owner NAGASE CHEMTEX CORPORATION