Composite board structure

A technology of composite board and polymer layer, which is applied in the direction of building structure, synthetic resin layered products, layered products, etc., can solve the problems of diversity and poor texture, and achieve the effect of high mechanical strength and good environmental protection

Inactive Publication Date: 2016-06-01
KUNSHAN SUNDERER ELECTRONICS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

FRP composite materials are used for surface decoration boards, and melamine paper is often used as surface decoration materials, but its diversity and texture are not good

Method used

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  • Composite board structure
  • Composite board structure
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Embodiment Construction

[0012] The present invention will be further described below in conjunction with accompanying drawing:

[0013] see Figure 1 to Figure 3 :

[0014] One type of composite panel structure is a molded structure comprising layers of fiber reinforced polymer and a structural layer of wood.

[0015] Further, each basic unit of the composite board structure includes: FRP sheet material or group material, and sheet-like solid wood.

[0016] Put the flaky solid wood material and FRP flakes or groups into the mold of the molding machine, and use the temperature of the mold to make the FRP flakes or groups flow in the mold and tightly combine with the wood chips.

[0017] figure 1 Shown is the structural representation of the wood structure layer of the present invention;

[0018] figure 2 Shown are fiber reinforced polymer layers of the present invention individually molded to form a structure;

[0019] The present invention can be molded into various shapes, and can be used as ...

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PUM

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Abstract

The invention discloses a composite board structure. The composite board structure is formed by a fiber reinforced polymer / plastic layer and a wood layer through a mould pressing technology. Each basic unit of the composite board structure comprises an FRP (fiber reinforced polymer / plastic) sheet or lump and a flaky solid wood. The composite board structure can be formed into various shapes and can serve as a construction dale. In one embodiment, the composite board structure can be applied to surface boards of a heating floor and is attractive, high in mechanical strength, waterproof, light but hard, non-conducting and resistant to corrosion; being free from glue, the composite board structure cannot produce glue volatile substances due to high temperature during use, and accordingly good environmental friendliness is achieved. In the other embodiment, the composite board structure can be also applied to surface boards of a water heating floor, so that the environmental pollution problem that traditional glued wood boards are heated to enable a glued floor to produce organic solvent volatilization can be avoided.

Description

technical field [0001] The invention belongs to the field of building boards, in particular to a material formed by combining fiber-reinforced polymer (FRP) and wood through a molding process and a preparation method thereof. Background technique [0002] Fiber Reinforced Polymer / Plastic (FRP for short), FRP composite material is a high-performance material formed by mixing fiber material and matrix material (resin) in a certain proportion. Lightweight and hard, non-conductive, high mechanical strength, corrosion resistance. FRP composite materials are used for surface decoration boards, and melamine paper is often used as surface decoration materials, but its variety and texture are not good. Contents of the invention [0003] The purpose of the present invention is to provide a composite panel structure, aiming at improving the diversity and texture of the surface decoration of fiber reinforced composite materials. [0004] The present invention is achieved in this way...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02B32B21/08B32B27/04B32B7/12
CPCE04F15/042B32B7/12B32B21/08B32B2260/021
Inventor 秦秀芬
Owner KUNSHAN SUNDERER ELECTRONICS IND
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