Large-scale area array ultrasound probe for deep brain stimulation and neuromodulation and its preparation method

A deep brain stimulation and large-scale technology, applied in ultrasound/acoustic/infrasonic diagnostics, acoustic diagnostics, infrasonic diagnostics, etc., can solve problems such as difficult calibration to precise positions, cumbersome calibration, etc.

Active Publication Date: 2018-10-16
GREEN VALLEY BRAINTECH SHENZHEN MEDICAL TECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the piezoelectric element is not cut through, it is still connected together, and there will be a lot of crosstalk interference between the piezoelectric array elements.
And the layer-by-layer welding method is very cumbersome to calibrate each time, and it is not easy to calibrate to the precise position

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Large-scale area array ultrasound probe for deep brain stimulation and neuromodulation and its preparation method
  • Large-scale area array ultrasound probe for deep brain stimulation and neuromodulation and its preparation method
  • Large-scale area array ultrasound probe for deep brain stimulation and neuromodulation and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Such as figure 1 As shown, it is a flow chart of the preparation method of the large-scale area array ultrasound probe for deep brain stimulation and neuromodulation.

[0037] A method for preparing a probe of large-scale area array ultrasound for deep brain stimulation and neural regulation; comprising the following steps:

[0038] Before the step of getting the finely ground piezoelectric composite material, include:

[0039] The piezoelectric composite material 101 is finely ground until its thickness reaches a preset size.

[0040] Step S110, take the finely ground piezoelectric composite material, cut M rows of concave grooves along its transverse direction, and add decoupling material in the concave grooves; then cut N rows of concave grooves along its longitudinal direction, and The decoupling material is added in the shaped grooves; wherein, the direction of the M rows of concave grooves and the N columns of concave grooves is the same.

[0041] Specifically,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A deep brain-stimulated and nerve-regulated large-scale area array ultrasonic probe and a preparation method for the same are provided. First, MxN piezoelectric composite material is prepared; the piezoelectric composite material is cut through, so string sound interference between adjacent piezoelectric array elements can be greatly reduced. A technology method of sputtering electrode layer and electrode disperse cutting is employed. A first front electrode is dispersed according to array element arrangements; a ground electrode is not dispersely cut and led to a first front electrode layer via a binding electrode layer to reduce a ground electrode signal lead wire; meanwhile, single face concentrative wiring can be achieved; and the technology is simple and reliable. A multi-layered flexible circuit board is employed for wiring; an array of a lead wire end of the multi-layered flexible circuit board is the same as the array element arrangements; a two-side aligning method is employed to align the lead wire end of the multi-layered flexible circuit board and a lead wire end of the corresponding array element electrode signal; and an accurate position of the multi-layered flexible circuit board can be found and the electrode signal lead wire can be accurately lead out.

Description

technical field [0001] The invention relates to an ultrasonic radiation force probe, in particular to a large-scale area array ultrasonic probe with a simple process for deep brain stimulation and neural regulation and a preparation method thereof. Background technique [0002] Large-scale area array ultrasound probe for ultrasound deep brain regulation. Moreover, it is especially suitable for multi-point regulation for different brain neural function zones. In recent years, due to the global focus on research on the prevention and treatment of neurodevelopmental diseases and mental diseases, the Brain Science Program has officially started, and the majority of scientific and technological workers are looking for various means and methods to perform deep brain intervention and stimulation regulation on patients. The scale area array ultrasound probe is very convenient to adjust the size, intensity and direction of the focal point, so it can become a non-invasive tool and me...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): A61B8/00
Inventor 郑海荣郭瑞彪李永川钱明薛术陈然然
Owner GREEN VALLEY BRAINTECH SHENZHEN MEDICAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap