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Computer system and method for adaptive thermal resistance-capacitance network analysis

A computer system, resistance and capacitance technology, applied in the field of heat flow simulation, can solve problems such as inaccurate heat flow simulation results, inaccurate heat flow distribution, etc.

Inactive Publication Date: 2016-06-08
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the traditional thermal RC network emulator is used in a different system (such as another portable device), the thermal flow simulation results will become less accurate
In other words, traditional thermal RC network emulators are inaccurate for pre-quasi-steady-state heat distribution (such as system-on-chip temperature in portable devices)

Method used

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  • Computer system and method for adaptive thermal resistance-capacitance network analysis
  • Computer system and method for adaptive thermal resistance-capacitance network analysis
  • Computer system and method for adaptive thermal resistance-capacitance network analysis

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Embodiment Construction

[0054] In order to make the above objects, features and advantages of the present invention more comprehensible, a preferred embodiment will be described in detail below together with the accompanying drawings.

[0055] figure 1 An isometric view showing a spatial layout of the portable device 100 according to an embodiment of the invention. Note that, figure 1 The illustrated embodiments are not intended to represent a broad layout of the portable device 100, but are presented in an illustrative manner. In one embodiment, the portable device 100 includes a housing 110 , an upper layer 120 , a middle layer 130 , and a lower layer 140 . The upper layer 120 , the middle layer 130 , and the lower layer 140 are disposed on or within the housing 110 . For example, the upper layer 120 can be a liquid crystal display (LCD), or LED layer, which can include a top cover, an LCD or LED cover, and an LCD or LED screen. The middle layer 130 is a printed circuit board (PCB), sandwiche...

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Abstract

A method for adaptive thermal resistance-capacitance (RC) network analysis of a semiconductor device for use in a portable device is provided. The method includes the steps of: receiving a device input file and a plurality of specific effective heat transfer coefficients (HTCs) associated with the portable device; repeatedly performing a thermal analysis of the portable device based on the device input file and a current effective HTC to estimate a target die temperature of the semiconductor device; calculating a target effective HTC based on the device input file and the target die temperature; and updating the current effective HTC with the target effective HTC; and generating an output file recording the target die temperature of the semiconductor device.

Description

technical field [0001] The present invention relates to heat flow simulation, and more particularly to a computer system and method thereof capable of performing heat flow resistance-capacitance (RC) network analysis in a portable device. Background technique [0002] Portable devices such as smartphones and tablets suffer from reduced performance due to heat flow limitations created by increased power consumption in applications. Unfortunately, traditional active cooling systems such as fan cooling or advanced microfluidic cooling cannot be used in portable devices, which makes heat dissipation more difficult. Therefore, thermal issues in handheld devices, especially for high-end smartphones, are becoming more and more intractable, and an effective and efficient heat flow simulator is needed to capture the thermal flow behavior in portable devices. [0003] Figure 8 Schematic showing air flow using passive cooling in a portable device. For passive cooling of portable dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F2111/10G06F30/20G01N33/0078G01N33/0095G01N25/18
Inventor 李育民潘麒文邱鸿文陈泰宇郑道许文松李圣良
Owner MEDIATEK INC
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