Power module structure with vapor chamber heat radiation substrate

Abstract

A power module structure with a vapor chamber heat radiation substrate comprises the vapor chamber heat radiation substrate with a vapor chamber heat radiation system. The vapor chamber heat radiation system is formed by a vacuum cavity with a fine structure in the vapor chamber heat radiation substrate and a certain number of cooling fins connected with the vacuum cavity. A certain number of supporting blocks for supporting the upper face and the lower face of the vacuum cavity are arranged in the vacuum cavity, and a proper quantity of heat radiation media is injected into the vacuum cavity. A copper coated ceramic substrate is welded to the vapor chamber heat radiation substrate through solder and formed by sintering copper layers to the upper face and the lower face of an insulation ceramic layer, power devices are welded to the copper layer on the upper face through solder and connected through a wire to form a circuit structure, and the copper layer on the lower face of the copper coated ceramic substrate is welded to the vapor chamber heat radiation substrate through solder. The power module structure has the advantages of being high in heat radiation efficiency, compact in structure, high in reliability and the like.

Description

technical field [0001] The invention relates to a power module structure provided with a vapor chamber heat dissipation structure, and belongs to the technical field of semiconductor power module design and packaging. technical background [0002] A traditional semiconductor power module is assembled by brazing a chip, a copper-clad ceramic substrate (Direct Bonded Copper, DBC), and a heat dissipation substrate. When the semiconductor power module is working, the chip will generate heat, and most of the heat needs to be dissipated through the transfer of solder→DBC→solder→heat dissipation substrate→thermal grease→radiator. [0003] Traditional semiconductor power modules are coated with a layer of thermal grease on the surface of the heat dissipation substrate before installation, and then installed on the radiator; the thickness of thermal grease is generally between 0.08mm and 0.15mm, and the thermal resistance of thermal grease Higher thermal resistance than copper heat ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problem of low heat dissipation efficiency of existing power modules in application, and to provide a power module structure with vapor chamber heat dissipation base plate with compact structure, high heat dissipation efficiency, good working stability, and prolonging the service life of the power module

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