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Improved composite board

A technology of composite plates and substrates, applied in the field of plates, can solve the problems that ordinary plates cannot meet the demand, and achieve the effect of enhancing heat exchange effect and enhancing thermal insulation effect.

Inactive Publication Date: 2016-06-15
王亚萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, more and more families are laying floor heating on the floor, but the existing ordinary boards cannot meet the demand

Method used

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Embodiment 1

[0014] Such as figure 1 and figure 2 As shown, an improved composite panel of the present invention includes a base plate 1, a first thermal insulation layer 2 is provided on the substrate 1, a fireproof layer 3 is provided on the first thermal insulation layer 2, and a second thermal insulation layer is provided on the fireproof layer 3 4. The second insulation layer 4 is provided with a first reinforcement layer 5, the upper end of the first reinforcement layer 5 is provided with a cavity layer 6, the cavity layer 6 is provided with a second reinforcement layer 7, and the second reinforcement layer 7 is provided with a heat conduction layer. Layer 8, the upper end of the heat conducting layer 8 is provided with a fireproof layer 9, the fireproof layer 9 is provided with a wear-resistant layer 10, and the cavity layer 6 is provided with criss-crossing pipe cavities 11. The double-layer insulation of the first insulation layer 2 and the second insulation layer 4 enhances the...

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Abstract

The invention relates to an improved composite board. The improved composite board comprises a base board. A first heat insulating layer is arranged on the base board, a fireproof layer is arranged on the first heat insulating layer, a second heat insulating layer is arranged on the fireproof layer, a first reinforcing layer is arranged on the second heat insulating layer, a cavity layer is arranged at the upper end of the first reinforcing layer, a second reinforcing layer is arranged on the cavity layer, a heat conducting layer is arranged on the second reinforcing layer, another fireproof layer is arranged at the upper end of the heat conducting layer, a wear-resistant layer is arranged on the fireproof layer, and criss-cross pipeline cavities are formed in the cavity layer. The improved composite board has the advantages that by adopting the first heat insulating layer and the second heat insulating layer for double-layer heat insulation, the heat insulating effect of the board is enhanced; by arranging the cavity layer with the pipeline cavities in the board, the demands for installing floor heating systems in houses and the like in the prior art can be met, the heat exchange effect of floor heating systems can be enhanced through the heat conducting layer, and the problem that the hardness of the board is inefficient due to the arrangement of the cavity layer can be solved through the first reinforcing layer and the second reinforcing layer.

Description

technical field [0001] The invention relates to a board, in particular to an improved composite board. Background technique [0002] Board is an important material in decoration, and the types of boards are cumbersome, mainly including solid wood board, large core board, bamboo puzzle board, density board, veneer board, thin core board, finger joint board, melamine board, waterproof board, gypsum board, cement board , paint-free board, baking varnish board, particle board, etc., you can choose different types of boards according to different decoration requirements. At present, more and more families are laying underfloor heating on the floor, but the existing common boards cannot meet the demand. [0003] Therefore, it is necessary to seek a new technical solution to solve the above problems Contents of the invention [0004] The object of the present invention is to provide an improved composite board. [0005] In order to achieve the above object, the technical schem...

Claims

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Application Information

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IPC IPC(8): B32B3/26B32B33/00
CPCB32B3/26B32B33/00B32B2307/302B32B2307/304B32B2307/3065B32B2307/536B32B2307/554
Inventor 王亚萍
Owner 王亚萍
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