A gallium arsenide substrate low-brightness yellow light-emitting diode chip and manufacturing method thereof
A light-emitting diode, low-brightness technology, used in electrical components, circuits, semiconductor devices, etc., can solve problems such as irregularities and the decline in the ability of chip products to resist electrostatic breakdown.
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[0029] 1. Epitaxial wafer and chip production process steps:
[0030] 1. will n The type GaAs substrate is placed in the reaction chamber of the MOCVD system, heated to 600 ℃ ~ 700 ℃, the passivation layer on the surface of the substrate is removed, and the n One side of the type GaAs substrate grows to form a certain thickness, doped with silicon n type GaAs buffer layer.
[0031] 2. Using Al on the GaAs buffer layer x Ga 1-x As is the material for deposition, where, 0.1≤X≤1, the deposited n Thickness of type anti-reflection layer d matches the following relationship: n (λ) · d = N · λ / 2; where λ is the center wavelength of the electroluminescence of the epitaxial wafer, n (λ) is the refractive index of the layer material for light with a wavelength of λ, N is a positive integer, and 1≤ N ≤10.
[0032] 3. Deposition and formation on the anti-reflection layer n type carrier confinement layer.
[0033] 4. In n A double heterojunction active region layer is dep...
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