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Waterborne diamond wire silicon wafer cutting liquid

A silicon chip cutting fluid and diamond wire technology, applied in the petroleum industry, lubricating compositions, etc., can solve the problems of difficult cleaning of solid silicon fine powder, etc., and achieve the effects of low equipment requirements, easy control of conditions, and low cost

Active Publication Date: 2016-06-22
CHANGZHOU GREATOP NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to avoid the process of wire-cutting silicon wafers with diamond sand, leaving a lot of solid silicon fine powder that is not easy to clean off on the surface of the obtained silicon wafers, thereby ensuring the surface smoothness of silicon wafer products

Method used

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  • Waterborne diamond wire silicon wafer cutting liquid
  • Waterborne diamond wire silicon wafer cutting liquid
  • Waterborne diamond wire silicon wafer cutting liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A water-based diamond wire silicon wafer cutting fluid, calculated in parts by weight as the following components:

[0020]

[0021] The above-mentioned surfactants are alcohol-based nonionic surfactants with the structure RO(C 3 H 6 O)a(CH 2 CH 2 O)b(C 3 H 6 O)cH,

[0022] Wherein, R is n-butyl, a=18, b=20, c=15;

[0023] The preparation method of the water-based diamond wire silicon wafer cutting fluid in this embodiment is as follows:

[0024] At room temperature (25°C), add the above-mentioned surfactants, penetrants, defoamers, styrene-butadiene rubber emulsion binders and extreme pressure agents to deionized water, and stir evenly to obtain water-based diamond wire silicon wafer cutting fluid.

Embodiment 2

[0026] A water-based diamond wire silicon wafer cutting fluid, calculated in parts by weight as the following components:

[0027]

[0028] The above-mentioned surfactants are alcohol-based nonionic surfactants with the structure RO(C 3 H 6 O)a(CH 2 CH 2 O)b(C 3 H 6 O)cH,

[0029] Wherein, R is isobutyl, a=14, b=23, c=13;

[0030] The preparation method of the water-based diamond wire silicon wafer cutting fluid in this embodiment is as follows:

[0031] At room temperature, add the above-mentioned surfactants, penetrants, defoamers, styrene butadiene rubber emulsion binders and extreme pressure agents to deionized water, and stir evenly to obtain water-based diamond wire silicon wafer cutting fluid.

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Abstract

The invention belongs to the technical field of silicon crystal cutting, and particularly relates to waterborne diamond wire silicon wafer cutting liquid. The waterborne diamond wire silicon wafer cutting liquid is prepared from an extreme pressure agent, surfactant, a defoaming agent, a penetrating agent, butadiene styrene rubber latex binding agent and deionized water. The waterborne diamond wire silicon wafer cutting liquid obtained through the formula has excellent lubricating, cooling, anticorrosive, rust-proof and extreme-pressure-resisting functions, on the basis, a preparing method is simple in technology, low in cost, low in requirement for equipment and suitable for industrial production, and conditions are easy to control.

Description

Technical field [0001] The invention belongs to the technical field of silicon crystal cutting, and particularly relates to an aqueous diamond wire silicon wafer cutting fluid. Background technique [0002] With the rapid development of the global solar energy and microelectronics industries, the demand for silicon wafers is growing rapidly. Slicing is the first process of silicon wafer processing, and it is also one of the main processes that cause silicon wafer stress, surface and sub-surface damage and edge chipping. The performance of the cutting fluid is one of the key factors affecting wafer cutting efficiency and quality . [0003] The current silicon wafer cutting process mainly uses free mortar cutting suspension and diamond sand wire cutting, while diamond sand wire cutting is a newer cutting process that uses the friction between the diamond plated on the sand wire and the silicon wafer to cut , The cutting fluid no longer needs to suspend silicon carbide particles, no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02C10N30/04
CPCC10M173/02C10M2201/087C10M2205/04C10M2205/06C10M2209/103C10M2209/104C10M2229/041C10N2030/04
Inventor 张小飞
Owner CHANGZHOU GREATOP NEW MATERIAL CO LTD
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