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Glue removing agent for LED (light emitting diode) encapsulation residue glue

A technology of LED encapsulation and residual glue, applied in the directions of detergent compounding agent, detergent composition, detergent composition solvent, etc., can solve the problems such as can not be completely solved, and achieve the effect of simple configuration, convenient operation and low cost

Inactive Publication Date: 2016-06-22
SHENZHEN SHENGYUAN SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It also cannot completely solve the problems of peeling off from LED pins and brackets, tensile strength and adhesive force in the potting of LED display devices. However, epoxy resin has better adhesive force, and epoxy encapsulation materials are also used in the LED industry. wide application

Method used

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  • Glue removing agent for LED (light emitting diode) encapsulation residue glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10

[0016] Examples 1-10, the specific formulations are shown in Table 1.

[0017] Formulation table of each embodiment of table 1

[0018]

[0019] According to the formula in Table 1, weigh the corresponding substances and mix them evenly to obtain the adhesive remover.

[0020] In the embodiment provided by the present invention, according to the formula in Table 1, configure glue remover, electronic silicone (RTV-T)-LED or (RTV-5801)-LED special potting glue, when potting, first put A, B The two components are mixed and stirred evenly in the container, and then potted, but when the glued container is used again, the residual glue needs to be cleaned, otherwise, the glue is easy to produce filaments, which will affect the fluidity, poor potting, and the container If there are uncured and cured components, use this glue remover, soak at room temperature for 30 minutes, wash with water, and blow dry to achieve the glue removal effect.

[0021] According to the formula in the...

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PUM

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Abstract

The invention discloses a glue removing agent for LED (light emitting diode) encapsulation residue glue. The glue removing agent is basically prepared from the following ingredients in percentage by weight: 30 to 80 percent of solvents, 10 to 60 percent of diluting agents, 5 to 10 percent of penetrating agents, 0.1 to 5 percent of metal protecting agents, 0.1 to 5 percent of catalysts and 0.1 to 0.5 percent of surface active agents. The product can be used for removing silica gel and epoxide resin encapsulation glue remained by an LED encapsulation material on equipment; the effect is good; no corrosion is left on the equipment; toxicity on the human body is low; compared with conventional methylene dichloride, carbon tetrachloride, tetrachloroethylene, acetone, toluene, xylene and vinyl acetate, the effect is equivalent; the consumption is low; the environment-friendly effect is achieved; the use is convenient.

Description

technical field [0001] The invention relates to the field of LED packaging production, in particular to a glue remover for LED packaging glue. technical background [0002] In recent years, the application range of LED in urban lighting engineering, electrical industry and civil construction has become wider and wider. Semiconductor light-emitting diode (LED) is a solid-state semiconductor device that converts electrical energy into visible light. The spectrum of LED is almost concentrated in the visible light frequency band, and its luminous efficiency can reach 80% to 90%. It is a new type of high-efficiency light source with energy saving, Environmental protection, long life and other three major advantages. Under the background of global energy shortage, LED is more and more concerned by people. LED display devices must have good environmental adaptability because they are exposed to harsh and harsh environments for a long time. The purpose of potting LED display devi...

Claims

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Application Information

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IPC IPC(8): C11D1/835C11D1/62C11D1/645C11D3/60C11D3/20C11D3/28C11D3/37C11D3/43C11D3/44C11D3/04
CPCC11D1/835C11D1/62C11D1/645C11D1/721C11D3/044C11D3/201C11D3/2017C11D3/2044C11D3/2068C11D3/2096C11D3/28C11D3/3707
Inventor 刘德强
Owner SHENZHEN SHENGYUAN SEMICON
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