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Device for detecting two-dimensional shape and temperature of wafer substrate

A wafer and substrate technology, which is applied in the field of devices for detecting the two-dimensional morphology of wafer substrates, can solve problems affecting consistency, system error, and difficulty in ensuring PSD consistency, and achieve the effect of ensuring consistency and high coating accuracy

Active Publication Date: 2018-03-30
北京艾瑞豪泰信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the relatively complex structure of the light-passing device and its own system error, it is difficult to ensure the consistency of the light received by each PSD
In addition, in this device, the light beams in each direction have their own reflection and transmission elements on the optical path, which further affects the consistency of the light received by each PSD

Method used

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  • Device for detecting two-dimensional shape and temperature of wafer substrate
  • Device for detecting two-dimensional shape and temperature of wafer substrate
  • Device for detecting two-dimensional shape and temperature of wafer substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] For ease of understanding, Embodiment 1 of the present invention only provides one of the light beams in the first direction and the light beam in the second direction.

[0022] See attached figure 1 The device for detecting the two-dimensional topography of the wafer substrate provided by Embodiment 1 of the present invention includes N PSDs 1 or 1', N beams of the first type of laser light, and N first beam splitters 4 corresponding to the N beams of the first type of laser light one-to-one. Or 4', N second beam splitters 14 or 14' corresponding to N beams of the first laser one-to-one, a temperature measuring device, N beams of lasers are arranged along a straight line, wherein, N is a natural number above 3, and N PSD1 Or 1' corresponds to N laser beams one by one, and N PSD1 or 1' are respectively arranged on the left and right sides of N beam lasers, including left PSD1' and right PSD1, and the temperature measuring device can emit the second laser;

[0023] Each...

Embodiment 2

[0046] See attached figure 2 , the difference from the device for detecting the two-dimensional topography of the wafer substrate provided in Embodiment 1 of the present invention is that in the device for detecting the two-dimensional topography of the wafer substrate provided in Embodiment 2 of the present invention, the N beams of the first laser A corresponding N first beam splitters 4 or 4' and / or N second beam splitters 14 or 14' corresponding to N beams of the first laser light are integrated into one piece respectively, and figure 2 Among them, N first light splitters are integrated into one piece, and the label is 21, and N second light splitters are integrated into one piece, and the number is 22; corresponding to the area of ​​the light beam in the first direction, the coating of the first light splitter 21 makes it in ( lambda 1 -10nm, lambda 1 The reflectance in the wavelength range of +10nm) is 50%, corresponding to the area of ​​the light beam in the second ...

Embodiment 3

[0053] See attached image 3 And attached Figure 8 , the difference from the device for detecting the two-dimensional topography of the wafer substrate provided in the third embodiment of the present invention is that in the device for detecting the two-dimensional topography of the wafer substrate provided in the third embodiment of the present invention, the N beams of laser light are composed of a multi-channel laser The launcher sends out.

[0054] The multi-channel laser emitting device includes a multi-channel beam splitting prism 37 and a laser 36. The multi-channel beam splitting prism 37 includes a plurality of beam-splitting surfaces parallel to each other, and the included angle α between the multiple beam-splitting surfaces and the horizontal direction is 45° respectively. The centers of the multiple beam-splitting surfaces are on the same straight line, and the laser light emitted by the laser 36 is directed to one of the outermost beam-splitting surfaces along ...

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Abstract

The device for detecting the two-dimensional shape and temperature of a wafer substrate provided by the invention belongs to the technical field of non-destructive testing of semiconductor materials. The device for detecting the two-dimensional shape and temperature of the wafer substrate is respectively provided with a coating area on the N first beam splitters and N second beam splitters, and the coating area makes each beam splitter form different reflectivity and transmittance, thereby passing N first beam splitters and N second beam splitters can split the N beams of the first reflected light incident on the sample and returned into two directions for detection respectively, and can obtain the two-dimensional topography of the wafer substrate for detection The device also couples a temperature measuring device to the first or second spectrometer by coating the corresponding area of ​​the first or second spectrometer to obtain data for detecting the temperature of the wafer substrate. Due to the extremely high precision of the coating, the consistency of light received by the PSD in different propagation directions can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of non-destructive testing of semiconductor materials, in particular to a device for testing the two-dimensional shape of a wafer base. Background technique [0002] The invention patent application with the application number 201410189094.1 relates to a device for real-time and rapid detection of the two-dimensional topography of the wafer substrate, including N PSDs, N beams of laser light and a first beam splitting element. The N beams of laser light are arranged along a straight line, wherein the Said N is a natural number greater than 3, said N PSDs correspond to N beams of laser light one by one, said N beams of laser light first shoot to said first light splitting element, and form incident light after passing through said first light splitting element, said The incident light is incident on the wafer substrate, and N incident points are formed in the radial direction on the wafer substrate, and the i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/245G01K11/30
Inventor 刘健鹏马铁中
Owner 北京艾瑞豪泰信息技术有限公司