Heat treatment apparatus and heat treatment method
A technology for heat treatment and treatment of containers, used in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc. The effect of uniformity
Active Publication Date: 2016-06-22
TOKYO ELECTRON LTD
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Abstract
The present invention provides a technique in which, in performing a heat treatment on a coating film formed on a substrate, a sublimate is suppressed from leaking out to the outside of a processing container and a good in-plane uniformity with respect to a film thickness of the coating film is obtained. The wafer coated with the SOC film is placed in the processing container (1), the wafer is heated, and the crosslinking reaction proceeds by performing the exhaust from a central exhaust port (34) in a small exhaust amount while performing the exhaust from outer circumferential exhaust ports (31) in a large exhaust amount. In another exemplary embodiment, only the exhaust by the outer circumferential exhaust ports (31) may be performed from the heating start of the wafer, and after 20 seconds from the heating start time, the exhaust from the central exhaust port (34) may be performed in addition to the exhaust from the outer circumferential exhaust ports (31). In another exemplary embodiment, the exhaust is performed only from the outer circumferential exhaust ports (31) for 20 seconds from the heating start time of the wafer, then the exhaust from the outer circumferential exhaust ports (31) is stopped, and the exhaust is performed only from the central exhaust port (34).
Application Domain
Semiconductor/solid-state device manufacturing
Technology Topic
Start timeEngineering +2
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