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A kind of low water absorption phenolic resin insulating glue

A phenolic resin, low water absorption technology, applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of fast water absorption, decreased insulation performance, etc., to achieve full reaction and cost reduction , the effect of simple process

Active Publication Date: 2018-01-23
NORTHEAST FORESTRY UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the existing phenolic resin has strong water absorption and fast water absorption speed, which leads to the decline of insulation performance, and provides a preparation method of phenolic resin insulating glue with low water absorption and excellent long-lasting insulation

Method used

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  • A kind of low water absorption phenolic resin insulating glue
  • A kind of low water absorption phenolic resin insulating glue

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specific Embodiment approach 1

[0020] Specific embodiment one: A kind of low water-absorbing phenolic resin insulating glue of this embodiment consists of 155 to 190 parts of phenol, 14 to 20 parts of NaOH solution, 270 to 345 parts of formaldehyde solution and 4.7 parts by weight. The composition is composed of γ-aminopropyltriethoxysilane of 1 to 15 parts; the NaOH solution is a NaOH aqueous solution with a mass fraction of 40% to 50%, and the formaldehyde solution is a formaldehyde aqueous solution with a mass fraction of 37% to 39%.

specific Embodiment approach 2

[0021] Specific embodiment two: the preparation method of a kind of low water-absorbing phenolic resin insulating glue of this embodiment is carried out according to the following steps:

[0022] 1. Weigh 155 to 190 parts of phenol, 14 to 20 parts of NaOH solution, 270 to 345 parts of formaldehyde solution and 4.7 to 15 parts of γ-aminopropyltriethoxysilane in parts by weight ; The formaldehyde solution taken by weighing is divided into two parts A and B, wherein the quality of A is 70%~85% of the total mass of formaldehyde solution, and the quality of B is 15%~30% of the total mass of formaldehyde solution; the NaOH solution It is an aqueous NaOH solution with a mass fraction of 40% to 50%, and the formaldehyde solution is an aqueous formaldehyde solution with a mass fraction of 37% to 39%;

[0023] 2. Add the phenol weighed in step 1 into the container, melt at 40°C-50°C, then add the NaOH solution weighed in step 1 to obtain a mixed solution, and react for 8min-12min;

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specific Embodiment approach 3

[0027] Specific embodiment 3: The difference between this embodiment and specific embodiment 2 is that in step 1, 172 parts of phenol are weighed in parts by weight. Other steps and parameters are the same as those in the second embodiment.

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Abstract

The invention relates to phenolic resin insulating gel and a preparation method thereof, in particular to low-hydroscopicity phenolic resin insulating gel and a preparation method thereof, and aims to solve the problem of insulativity lowering caused by high hydroscopicity and high water absorbing speed of existing phenolic resin.The low-hydroscopicity phenolic resin is composed of, by weight, 155-190 parts of phenol, 14-20 parts of NaOH solution of 40-50% in mass percentage, 270-345 parts of formaldehyde solution of 37-39% in mass percentage and 4.7-15 parts of gamma-aminopropyl triethoxysilane.In the synthesis process of the modified phenolic resin, a silane coupling agent KH550 is directly added into a reaction system for in-situ polymerization, so that reaction is more sufficient and the process is simple and easy to operate.

Description

technical field [0001] The invention relates to a phenolic resin insulating glue and a preparation method thereof, in particular to a low water absorption phenolic resin insulating glue and a preparation method thereof. Background technique [0002] Phenolic resin has excellent heat resistance, acid and alkali resistance, flame resistance and excellent electrical insulation. However, thermosetting phenolic resin still has high water absorption after curing. The reason is that there are polar phenolic hydroxyl groups and methylol groups on it. It is easy to combine, causing the phenolic resin to absorb water, which reduces the insulation performance of the phenolic resin under humid conditions, and there is a problem of safety in use. Therefore, in order to stabilize the insulation of phenolic resin, it is necessary to limit the effect of hydroxyl groups and reduce the water absorption of phenolic resin. The following two methods are often used: [0003] (l) Blocking of phe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G14/073C09J161/34
CPCC08G14/06C09J161/34
Inventor 王伟宏魏强
Owner NORTHEAST FORESTRY UNIVERSITY