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Polyphenylene ether resin and manufacturing method thereof, polyphenylene ether prepolymer and resin composition

一种聚苯醚树脂、树脂组成物的技术，应用在聚苯醚树脂领域，能够解决使用限制、阻燃性、耐热性介电常数、介电损耗韧性、反应性、黏度及溶解性特性无法令人满意等问题

Active Publication Date: 2016-07-27
ELITE ELECTRONICS MATERIAL KUNSHAN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing polyphenylene ethers (such as bishydroxypolyphenylene ether, bisethylene-benyl polyphenylene ether) are still limited and insufficient in use, especially in flame retardancy, heat resistance, dielectric constant, dielectric loss, One or more properties of toughness, reactivity, viscosity and solubility are unsatisfactory, so it is necessary to propose an improved polyphenylene ether to meet the requirements of production process and product characteristics

Method used

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  • Polyphenylene ether resin and manufacturing method thereof, polyphenylene ether prepolymer and resin composition
  • Polyphenylene ether resin and manufacturing method thereof, polyphenylene ether prepolymer and resin composition
  • Polyphenylene ether resin and manufacturing method thereof, polyphenylene ether prepolymer and resin composition

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manufacture example

[0119] The thermosetting polyphenylene ether resin preparation (I) of manufacturing example polymerization modification

[0120] Mix 400 grams (0.2mol) of SA-90 (purchased from Sabic) with 17.5 grams (0.1mol) of α, α'-dichloro-p-xylene and 33.9 grams (0.01mol) of tetrabutylphosphine bromide and 600 Add one gram of toluene into the stirring tank, heat to 75°C and stir to dissolve until evenly mixed. After the temperature was raised to 95° C., 45 g (1.125 mol) of NaOH and 33 g of deionized water were added, and the stirring was continued for 6 hours. After cooling to 70° C., 53.4 g (0.35 mol) of p-chloromethylstyrene (CMS-P) was added, and stirring was continued for 4 hours. After reacting for 4 hours, it was cooled to room temperature for neutralization, and 8.8 grams (0.09 mol) of phosphoric acid and 165 grams of deionized water were added. Let stand and divide into upper and lower layers. Add 330 grams of deionized water for stirring, and remove the waste liquid three time...

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Abstract

The invention discloses polyphenylene ether resin, and belongs to polymerization modified thermosetting polyphenylene ether resin; the polyphenylene ether resin has the structure represented by the formula (1) defined in the specification; the polymerization modified thermosetting polyphenylene ether resin has the advantages of better flame retardance, heat resistance, dielectric constant, dielectric loss, toughness, reactivity, viscosity, solubility and the like. Therefore, the polyphenylene ether resin is suitable for being made into prepregs, resin films, laminated boards, printed circuit boards and other items. In addition, the invention also discloses a manufacturing method of the polyphenylene ether resin, a prepolymer of the polyphenylene ether resin and a resin composition containing the polyphenylene ether resin.

Description

technical field [0001] The present invention relates to a polyphenylene ether resin, in particular to a thermosetting polyphenylene ether resin with good overall properties. In addition, the present invention also provides the aforementioned polyphenylene ether resin manufacturing method, polyphenylene ether prepolymer and resin composition. Background technique [0002] With the rapid development of electronic technology, the information processing of electronic products such as mobile communications, servers, and cloud storage continues to develop in the direction of "high-frequency signal transmission and high-speed digitalization". Therefore, low-dielectric resin materials have become the preferred choice for today's high-transmission rate substrates. The main development direction is to meet the requirements of high-speed information transmission and processing required by cloud technology and terminal servers. Therefore, the requirements for copper clad laminates (CCL...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/48C08L71/12B32B27/04B32B27/28
CPCC08G65/40C08G65/485C08L71/126C08L25/10C08K5/5397C08K7/18C08L2201/02
Inventor 高宇谢镇宇马子倩王荣涛田文君
Owner ELITE ELECTRONICS MATERIAL KUNSHAN
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