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Heat-dissipation LED lamp

A technology for LED lamps and LED light sources, which is applied to lampshades, lighting and heating equipment, cooling/heating devices for lighting devices, etc., can solve the problems of increased cost, increased weight of heat-dissipating LED lamps, and insufficient heat-taking capacity, and achieves the speed of heat dissipation. The effect of fast, low freezing point and strong heating capacity

Inactive Publication Date: 2016-08-03
JIANGSU TIWIN OPTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This heat dissipation method solves the defect of insufficient heat extraction capacity of simply using aluminum alloy profiles. Although the heat extraction capacity is lower than the phase change cooling method, compared with the phase change cooling method, the structure is simple, but because the density of copper is greater than that of aluminum The density of the alloy, thus resulting in an increase in the weight of the entire heat dissipation LED lamp and an increase in cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] figure 1 and figure 2 A heat dissipation LED lamp provided according to the first embodiment of the present invention is schematically shown.

[0033] Such as figure 1 As shown, a heat dissipation LED lamp provided by this embodiment of the present invention includes an LED light source substrate 1 and an outer shell 2, and an LED controller 5 is connected to the LED light source substrate 1, and the LED controller 5 controls a LED light source provided by the present invention. A heat dissipation LED light is turned on and off.

[0034] Such as figure 1 As shown, the outer casing 2 is a hollow cuboid, and the outer casing 2 is separated by a partition 201 to form two upper and lower cavities, wherein the upper cavity is the control cavity 13, the LED controller 5 is fixed in the control cavity 13, and the lower cavity For the cavity 12 , the partition 201 seals and isolates the control cavity 13 from the cavity 12 , preferably, the cavity 12 is larger than the con...

Embodiment 2

[0041] image 3 and Figure 4 A heat dissipation LED lamp provided according to the second embodiment of the present invention is schematically shown.

[0042] Such as image 3 As shown, a heat dissipation LED lamp provided by this embodiment of the present invention includes an LED light source substrate 1 and an outer shell 2, and an LED controller 5 is connected to the LED light source substrate 1, and the LED controller 5 controls a LED light source provided by the present invention. A heat dissipation LED light is turned on and off. Such as image 3 As shown, the LED controller 5 is connected to one end of the LED light source substrate 1,

[0043] Such as image 3 As shown, the outer casing 2 is a hollow hemisphere, and the outer casing 2 is separated by a partition 201 to form two upper and lower cavities, wherein the upper cavity is the control cavity 13, the LED controller 5 is fixed in the control cavity 13, and the lower cavity is The cavity is the cavity 12 ,...

Embodiment 3

[0051] A heat dissipation LED lamp provided in Embodiment 3 of the present invention has the same structure as the substrate of a heat dissipation LED lamp provided in Embodiment 2, the difference is that, as Figure 4 As shown, in this embodiment of the invention, two heat dissipation LED lamps are connected to an external liquid storage tank 122, such as Figure 4 As shown, the outer liquid storage tank 122 communicates with the cavities 12 of the two heat-dissipating LED lamps through four liquid passages 123 respectively.

[0052] In addition, as preferred, such as Figure 6 As shown, in this embodiment of the present invention, the graphite heat-taking plate 3 includes a heat-taking plate substrate 31 and several graphite fins 32 connected with the heat-taking plate substrate 31. In this embodiment of the present invention, 12 A graphite fin 32 is vertically connected with the heating plate base plate 31, and the graphite fin 32 is in a wave shape, and one end of the wav...

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Abstract

The invention provides a heat-dissipating LED lamp, comprising an LED light source substrate, an LED controller connected with the LED light source substrate, and an outer casing, and is characterized in that the LED light source substrate connected with the LED controller is buckled on one side of the outer casing, A cavity is formed in the outer casing, the back of the LED light source substrate is connected with a graphite heat taking plate, the graphite heat taking plate isolates the LED light source substrate from the cavity, and the cavity is filled with a heat storage liquid. The heat-dissipating LED lamp provided by the invention takes heat through a graphite heat taking plate basically connected with the LED light source substrate, and then absorbs the heat of the graphite heat taking plate through a heat storage liquid, and dilutes or takes away the heat. High heat dissipation efficiency; it can prevent the heat storage liquid from breaking the lamp body due to the thermal barrier cold shrinkage; the heat storage liquid has high cost point, low freezing point, fast cooling and heat dissipation, so that the temperature of the LED light source substrate is kept in a constant and stable state, At the same time, it will not freeze in winter, avoid the lamp body from freezing and cracking, and prolong the service life; at the same time, it has the effect of anti-scaling.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a heat dissipation LED lamp with strong heat extraction capacity and high heat dissipation efficiency. Background technique [0002] About 80% of the electric energy of the LED chip is converted into heat during the working process. If effective measures cannot be taken to release the heat into the environment, the junction temperature of the chip will increase, the luminous efficiency will decrease, and the lifespan will be shortened. Therefore, chip heat dissipation is a key issue that must be solved for high-power LED packaging. At present, the heat dissipation of LED chips mainly adopts the following cooling methods: [0003] 1. Air cooling: as Chinese patent CN105423254A discloses a LED radiator, the radiator is a hollow columnar radiator with ventilation at both ends, and several light source installation slots for installing light source bars are arranged on the oute...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21V29/70F21V29/76F21V3/00F21V29/58F21Y115/10
CPCF21V29/70F21V3/00F21V29/58F21V29/76
Inventor 严圣军
Owner JIANGSU TIWIN OPTO ELECTRONICS TECH
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