Electronic tag packaging equipment

Abstract

The invention discloses a piece of electronic tag packaging equipment which is used for chip inverted mounting, hot-pressing and production testing of electronic tags. A bonding arm and a dispensing arm are designed into a five-side closed groove structure, and thus a compact and light high-speed bonding arm and dispensing arm structure which is of high rigidity and has a function of flux leakage from the bottom is formed. A bonding head and a corresponding squint-eyed camera lens group are arranged on a linearly-driven carrier, so the antenna photographing task and the bonding or dispensing task are completed in the same position area, and the capacity is improved. By using tension control mechanisms of a linear bearing, a support optical axis, a cylinder and a spring, the friction resistance is reduced, the precision of tension control is improved, and a simple structure and low cost are achieved. A tag test drive mechanism connects a lower detection reading head and an upper marking head through a Y-direction synchronous belt bypassing an antenna film area so as to realize mechanical synchronous movement. The tag test drive mechanism is simplified, and the cost is reduced greatly.

Description

technical field [0001] The invention relates to the field of semiconductor packaging equipment, in particular to a flip-chip electronic label packaging equipment. Background technique [0002] At present, the technology of electronic label packaging equipment, especially the electronic label chip flip packaging equipment is: the film antenna enters the film loader after passing through the feeding tension mechanism and the deviation corrector, and the dispensing camera of the film loader first checks the position of each wire on the film. Take a photo, correct the visual position, and then dispense glue at the exact position. Flip the suction head to remove the chip from the wafer, flip it 180 degrees, and at the same time, the bonding camera will take pictures of the antenna that has been glued. Installed on the corresponding dispensing position. The antenna with the chip installed goes through the intermediate tension mechanism to the heat-pressing unit for a few seconds...

AI Technical Summary

Problems solved by technology

Due to the high friction of the guide rail slider of the linear mechanism, the tension control accuracy is not high, which affects the accuracy of film loading to a certain extent

Moreover, traditional institutions are more complicated and costly

[0006] As shown in the publication number CN203825647U, the detection machine used for electronic label detection, the tradition

Images