A Pattern Electroplating Method for Integrating Two Square Resistive Thin Film Circuits on the Same Plane of the Dielectric Substrate

A dielectric substrate and pattern electroplating technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of metal plating on the resistance layer and low pattern accuracy, reduce the risk of scratching the conductor pattern, and reduce the pattern resolution. High, improve the effect of circuit yield
CN105826231BActive Publication Date: 2019-01-18THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
Publication Date
2019-01-18

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Abstract

The present invention proposes a pattern electroplating method for integrating two kinds of square resistance thin film circuits on the same plane of a dielectric substrate, comprising the following steps: sequentially sputtering a large square resistance thin film, a small square resistance thin film on the same plane of a dielectric substrate, Adhesive layer film and conductor layer film; by coating photoresist, pre-baking, exposure, development and post-baking, a patterned photoresist area is formed on the surface to be patterned and plated; Thick metal electrode layer and protective layer; peel off the patterned photoresist, then etch the conductive layer film and adhesive layer film in the non-plated thickened area, and then remove the protective metal layer; photoetching to make a small square Resistance thin film resistors; photoetching to make large resistance thin film resistors. The circuit pattern produced by the invention has the advantages of small side growth of the conductor pattern, steep line edge, high pattern resolution and the like.
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Description

technical field

[0001] The invention relates to the technical field of manufacturing microwave and millimeter wave thin film circuits, in particular to a pattern electroplating method for integrating two square resistance thin film circuits on the same plane of a dielectric substrate. Background technique

[0002] An electric field radiation broadband detector based on distributed thin film resistance loading is suitable for radio frequency broadband electric field radiation detection in the near and far field full space area. The scheme adopts electric small probes loaded with distributed thin-film resistors to receive broadband electric field radiation, and then detects electric field radiation through high-sensitivity low-barrier Schottky diodes, and passes the detection signal through a low Pass filter RF signal isolation, so as to achieve the purpose of low distortion output. Electric field radiation broadband detector based on distributed thin film resistance loading,...

Claims

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