Discrete transparent ceramic flip chip integrated LED light source and packaging method thereof

Abstract

The invention discloses a discrete transparent ceramic flip chip integrated LED light source and a packaging method thereof. The discrete integrated LED light source is composed of a plurality of chip units. Each chip unit is composed of a substrate, solder paste, a flip chip and a transparent fluorescent ceramic piece sequentially from bottom to top. The two ends of the top of each substrate are each equipped with a dam. Each substrate is composed of three substrate segments which are segmented by a counter electrode. Each counter electrode is composed of a positive electrode and a negative electrode which do not contact each other. Each positive electrode or negative electrode is composed of an electrode layer 1 contacting the bottom surfaces of the corresponding substrate segments and an electrode layer 2 passing through the corresponding substrate and contacting the solder paste. The packaging volume of the LED light source is reduced effectively. The LED light source is small, thin and light. Under the condition of same luminous flux, the light density can be improved by reducing the light emitting surface. Higher power can be provided under the condition of same device size. Full-automatic and large-scale packaging is realized, the yield is increased, and the cost is reduced.

Description

technical field [0001] The invention belongs to the field of semiconductors, and relates to a discrete transparent ceramic flip-chip integrated LED light source and a packaging method thereof. Background technique [0002] At present, the LED industry is developing in the direction of small size, high energy efficiency, and high density and small pitch; the methods of flip-chip packaging COB currently include: [0003] 1. After flipping multiple chips on the substrate, coat the chip with organic silica gel mixed with phosphor powder, such as figure 1 shown; [0004] 2. Flip-chip multiple chips on the substrate, cover the whole transparent fluorescent ceramic sheet on the top of the chip, and fill the organic silica gel package between the chip and the ceramic sheet, such as figure 2 shown; [0005] However, these two methods have the following defects: [0006] 1. COB monolithic packaging devices have poor flexibility for subsequent assembly and cannot be standardized o...

AI Technical Summary

Problems solved by technology

[0006] 1. COB monolithic packaging devices have poor flexibility for subsequent assembly and cannot be standardized or automated;

[0007] 2. Phosphor powder and organic silica gel are mixed, the manufacturing process controls the color consistency poorly, and the bin yield rate is low;

[0008] 3. Covered by a whole piece of transparent fluorescent ceramics, it is easy to cause the fluorescent ceramics to break due to uneven heating;

[0009] 4. There is organic silica gel isolation between the ceramic sheet and the light-emitting chip, and the blue light passes through the organic silica gel to remotely excite transparent fluorescent ceramics to emit light. The remote excitation efficiency is reduced

[0010] There is a key light distribution problem in the design of lighting applications for LED light sources, that is, when using LED light sources as lighting sources, the light emitting direction, reflective angle, and illuminance distribution must be configured through lamps, reflectors, and lenses; The design is very difficult, and it is impossible to achieve a very ideal light distribution

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