Abstract integration design method of complex electronic system

An electronic system and integrated design technology, applied in computing, electrical digital data processing, special data processing applications, etc., can solve the problems of increased difficulty and complexity of system design, difficulty in inserting new functional requirements, and inability to share, etc., to achieve The effect of improving design efficiency and quickly adapting to changing requirements

Inactive Publication Date: 2016-08-10
10TH RES INST OF CETC
View PDF3 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This system integration method is relatively simple, but the integrated system has the following disadvantages: the software and hardware resources of the system are enclosed in each independent functional device, and the resources are not open and cannot be shared; the system is not open and scalable, and the system Once designed, it is difficult to make changes and insert new functional requirements; the system cannot adapt to the needs of technological development and progress. When new devices and new processes appear, only the overall changes can be made to the independent devices that make up the system , the cost is too high; these defects make traditional electronic systems have obvious defects in the overall performance of the system in the long life cycle, the cost of the whole life cycle, system volume, weight, etc.
At the same time, system integration design should not only take into account the current technical status, but also take into account the future development trend of technology, changes in system top-level task requirements and other factors, resulting in a sharp increase in the difficulty and complexity of system design, such as more than 100 system software component resources , the physical hardware can be reconfigured to deploy more than 400 subordinate processing node resources, and the deployment scheme from software component deployment to physical nodes exceeds The traditional "document + file" system integration design method has been difficult to adapt to this new and highly complex electronic information system design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Abstract integration design method of complex electronic system
  • Abstract integration design method of complex electronic system
  • Abstract integration design method of complex electronic system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] refer to figure 1 . In the abstract model of complex electronic information system, two aspects are involved, the target system and the visual modeling tool set. The visual modeling tool set realizes the abstraction and description of the target system. According to the present invention, in the complex electronic information system, the target system is divided into an open hardware layer, an open software layer and a task function layer. The open hardware layer constructs an open physical hardware platform through hardware bus interconnection, and the open software layer constructs an open software platform through software bus interconnection. The software model describes the functional thread information and the connection relationship between functional threads. Functional thread information includes logical components constituting the functional thread and connection relationships between logical components. The deployment configuration model describes the bind...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention puts forward an abstract integration design method of a complex electronic system, and aims to provide an open type system structure method which supports to insert new functions, is convenient for inserting an expandable module and exhibits high efficiency in integration, test and verification. The abstract integration design method is realized through the following technical scheme: in a complex electronic information system, through the interconnection of a hardware bus and/ or software bus, constructing an open physical hardware platform and an open type software platform, and establishing an abstract set of three sub-layers including a practical physical platform set layer, a software logic component set layer and a system function application set layer; in a visual modeling environment, analyzing and decomposing the complex electronic system, and constructing a hardware model, a software model and a deployment configuration model described by a logic component meta-model; and finally, uniformly storing logic component operation bodies in a file server or independently storing the logic component operation bodies in the nonvolatile memory of each hardware node, and analyzing and operating a blueprint file by a target system to deploy the logic component on the hardware nodes of a preset function unit.

Description

technical field [0001] The invention relates to a layered abstract integration design method of an open, growable and complex electronic information system. Background technique [0002] With the continuous development and innovation of microelectronics technology, the integration level and process level of large-scale integrated circuits have also been continuously improved. The combination of silicon materials and human intelligence produces a large number of low-cost, high-quality and high-precision microelectronic structural modules, promoting the development of a new technical field and industry. The current complex electronic information system usually adopts the "union" method for system integration design. The system is composed of several independent functional devices, each functional device is independent of each other, and the functional devices are interconnected through a standard bus (such as 1553B). This system integration method is relatively simple, but th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/00
Inventor 陈颖李典潘灵
Owner 10TH RES INST OF CETC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products