Self-aligning sintering clamp and method for semiconductor laser chip

Abstract

The invention relates to a self-aligning sintering clamp and method for a semiconductor laser chip. The clamp comprises a pedestal, a guide rail support, and a press block. The pedestal is provided with a positioning card slot matched with a heat sink. Two sides of the press block are provided with symmetric positioning racks. The guide rail support is vertically disposed on the pedestal, and is provided with symmetric suspension arms. The interior of each suspension arm is provided with a positioning guide rail. The positioning racks of the press block can be sleeved by the positioning guide rails, and move up and down in the positioning guide rails. The bottom end of the press block is provided with a press column. When the press block moves downwards, the press column compresses a chip on the heat sink. The invention also provides the method for sintering the semiconductor laser chip through the above clamp. The clamp is simple in structure, is low in cost, can achieve the self-aligning, and is convenient for operation and observation. The method can achieve the quick batch sintering of the semiconductor laser chips and heat sinks, and remarkably improves the sintering yield of the clamp.

Description

technical field [0001] The invention relates to a self-aligning sintering jig for semiconductor laser chips and a chip sintering method using the jig, belonging to the technical field of semiconductor laser chip sintering. Background technique [0002] Due to the advantages of small size, light weight, high electro-optical conversion efficiency, long life and high reliability, semiconductor lasers have gradually replaced the use of gas and solid-state lasers in the fields of communication, medical treatment, display, industrial production and security. It is also gradually expanding. The waste heat generated by the chip when the semiconductor laser is working needs to be discharged in a timely and effective manner, otherwise it will cause the temperature of the laser chip to be too high, reduce the luminous efficiency of the device and induce the failure of the laser. The currently widely used technical solution is to sinter the semiconductor laser chip onto a heat sink wit...

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that it is necessary to place heat sinks, chips and drop pressing pins under the microscope, which is inconvenient to operate and low in efficiency; and there are many parts in the whole device, it is difficult to process and assemble the precision parts required, and vacuum is required The equipment creates negative pressure to absorb heat sinks and chips, the manufacturing cost of the equipment is high, and it is not suitable for batch sintering

The disadvantage of this method is that the processing of the C-shaped bracket is relatively difficult; and after the heat sink and chip are placed on the alignment base and pushed into the positioning slot of the bracket, the chip on the heat sink cannot be observed due to the occlusion of the upper part of the bracket Whether there is any displacement during the placement process; in addition, during the thermal cycle of sintering, the spring used will undergo plastic deformation, resulting in a decrease in the pressing pressure, which may cause poor sintering of the chip

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