Wild-imitating planting substrate for dendrobium huoshanense and preparation method for wild-imitating planting substrate
A technology of Dendrobium officinale and wild imitation, which is applied in the directions of planting substrate, botanical equipment and method, culture medium, etc., can solve the problems of artificial cultivation of Dendrobium candidum, difficulty in replacement or maintenance, and high cost of seedbeds, achieves good water retention performance, promotes The effect of habitat growth and improved nutrient availability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0035] A dendrobium candidum imitation wild planting matrix, comprising the bottom matrix, middle matrix and upper matrix arranged successively from bottom to top; the thickness of the bottom matrix is 2cm, the thickness of the middle matrix is 3cm, and the thickness of the upper matrix is 2cm ;
[0036] According to the ratio of parts by weight, the bottom substrate is 15 parts of dry corn stalks;
[0037] The middle layer matrix is a mixture of 5 parts of vermiculite, 15 parts of decomposed alcohol biogas residue, 5 parts of corncob core, 15 parts of fir bark, 5 parts of coconut peat and 2 parts of Trichoderma hamstring fungus;
[0038] The upper matrix is 15 parts of modified biochar, 5 parts of semi-corroded guava branches, 5 parts of semi-corroded sugar orange branches, 2 parts of semi-corroded pear tree branches, 3 parts of semi-corroded horseshoe branches, 5 parts of expanded perlite, and pine bark A mixture of 10 parts, 5 parts of teaku, 5 parts of soybean m...
Embodiment 2
[0045] A dendrobium candidum imitation wild planting matrix, comprising the bottom matrix, middle matrix and upper matrix arranged successively from bottom to top; the thickness of the bottom matrix is 5cm, the thickness of the middle matrix is 2cm, and the thickness of the upper matrix is 5cm ;
[0046] According to the ratio of parts by weight, the bottom substrate is 20 parts of dry corn stalks;
[0047] The middle matrix is a mixture of 15 parts of vermiculite, 30 parts of decomposed alcohol biogas residue, 15 parts of corncob core, 20 parts of fir bark, 15 parts of coconut peat and 5 parts of Trichoderma harzianum fungicide;
[0048] The upper matrix is 35 parts of modified biochar, 20 parts of semi-corroded guava branches, 25 parts of semi-corroded sugar orange branches, 15 parts of expanded perlite, 35 parts of pine bark, 15 parts of tea dead, 15 parts of soybean meal, and 20 parts of ceramsite and a mixture of 2 parts of Trichoderma harzianum fungicide;
[...
Embodiment 3
[0055] A dendrobium candidum imitation wild planting matrix, comprising the bottom matrix, middle matrix and upper matrix arranged successively from bottom to top; the thickness of the bottom matrix is 4cm, the thickness of the middle matrix is 3cm, and the thickness of the upper matrix is 4cm ;
[0056] According to the ratio of parts by weight, the bottom substrate is 10 parts of dry sugarcane leaves;
[0057] The middle matrix is a mixture of 12 parts of vermiculite, 20 parts of decomposed alcohol biogas residue, 8 parts of corncob core, 16 parts of fir bark, 10 parts of coconut peat and 4 parts of Trichoderma harzian fungus;
[0058] The upper matrix is 18 parts of modified biochar, 18 parts of semi-corroded pear tree branches and 18 parts of semi-corroded horseshoe tree branches, 8 parts of expanded perlite, 16 parts of pine bark, 8 parts of tea dry, 8 parts of soybean meal, and 12 parts of ceramsite and the mixture of 2 parts of Trichoderma hacinae fungicide; ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com