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Improved composite board

A composite board and substrate technology, applied in the direction of layered products, building components, etc., can solve the problems that ordinary boards cannot meet the needs, and achieve the effect of enhancing heat exchange and heat preservation

Inactive Publication Date: 2016-09-14
王爱华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, more and more families are laying floor heating on the floor, but the existing ordinary boards cannot meet the demand

Method used

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  • Improved composite board
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Embodiment 1

[0014] Such as figure 1 and figure 2 As shown, an improved composite panel of the present invention includes a base plate 1, a first thermal insulation layer 2 is provided on the substrate 1, a fireproof layer 3 is provided on the first thermal insulation layer 2, and a second thermal insulation layer is provided on the fireproof layer 3 4. The second insulation layer 4 is provided with a first reinforcement layer 5, the upper end of the first reinforcement layer 5 is provided with a cavity layer 6, the cavity layer 6 is provided with a second reinforcement layer 7, and the second reinforcement layer 7 is provided with a heat conduction layer. Layer 8, the upper end of the heat conducting layer 8 is provided with a fireproof layer 9, the fireproof layer 9 is provided with a wear-resistant layer 10, and the cavity layer 6 is provided with criss-crossing pipe cavities 11. The double-layer insulation of the first insulation layer 2 and the second insulation layer 4 enhances the...

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Abstract

The invention relates to an improved composite board, which comprises a substrate. The substrate is provided with a first thermal insulating layer, the first thermal insulating layer is provided with a fireproof layer, the fireproof layer is equipped with a second thermal insulating layer, the second thermal insulating layer is provided with a first reinforcing layer, the upper end of the first reinforcing layer is equipped with a cavity layer, the cavity layer is equipped with a second reinforcing layer, the second reinforcing layer is provided with a heat conducting layer, the upper end of the heat conducting layer is provided with a fireproof layer, the fireproof layer is provided with a wear resistant layer, and the cavity layer is internally provided with crisscross pipeline cavities. According to the invention, the first thermal insulating layer and the second thermal insulating layer are employed to reinforce the thermal insulation effect of the board, and the pipeline cavities equipped cavity layer is disposed in the board to meet the existing demands of floor heating system installation and the like in families, and the heat conducting layer can strengthen the heat exchange effect of floor heating, and the arrangement of the first reinforcing layer and the second reinforcing layer can solve the board hardness problem caused by arrangement of the cavity layer.

Description

technical field [0001] The invention relates to a board, in particular to an improved composite board. Background technique [0002] Board is an important material in decoration, and the types of boards are cumbersome, mainly including solid wood board, large core board, bamboo puzzle board, density board, veneer board, thin core board, finger joint board, melamine board, waterproof board, gypsum board, cement board , paint-free board, baking varnish board, particle board, etc., you can choose different types of boards according to different decoration requirements. At present, more and more families are laying underfloor heating on the floor, but the existing common boards cannot meet the demand. [0003] Therefore, it is necessary to seek a new technical solution to solve the above problems Contents of the invention [0004] The object of the present invention is to provide an improved composite board. [0005] In order to achieve the above object, the technical schem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/20B32B33/00
CPCB32B3/20B32B33/00B32B2307/302B32B2307/3065B32B2307/554B32B2419/00B32B2419/04
Inventor 王爱华
Owner 王爱华
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