Gluing and developing synchronous clamp for thin film circuit ceramic sheet

Abstract

The invention discloses a gluing and developing synchronous clamp for a thin film circuit ceramic sheet, and aims to provide the gluing and developing synchronous clamp which is convenient to clamp and capable of reliably using an automatic vacuum adsorption rotary table. The gluing and developing synchronous clamp is implemented by the technical scheme as follows: ceramic sheet fixing plates (3) which are protruding out of the plane of a mounting mother plate, and L-shaped rotation pressing plates (4) are fixedly connected on the diagonal line around the mounting mother plate (1); locking holes (10) corresponding to fastening screw holes are formed in the diagonal lines of the ceramic sheet fixing plates (3); fastening screws (7) are inserted in the locking holes through the fastening screw holes to form a four-corner positioning enclosure frame, which is used for sealing and clamping plated-through hole ceramic sheet workpieces in the circumferential direction, of the ceramic sheet fixing plates; the mounting mother plate rotates along with the rotary table of the automatic gluing and developing equipment under vacuum adsorption; the plated-through hole thin film circuit ceramic sheet workpieces are subjected to synchronous surface photoresist spin-coating and developing based on pre-programmed programs; and the designed patterns of the thin film circuit ceramic sheets can be transferred to the surfaces of the plated-through hole ceramic sheets for realizing manufacturing of a subsequent circuit.

Description

technical field [0001] The invention relates to a synchronous fixture for gluing and developing thin film circuit tiles suitable for a vacuum turntable of automatic gluing and developing equipment. Background technique [0002] The manufacturing process of ceramic thin film circuit substrates must transfer the design graphics to the coated ceramics, so as to achieve the synchronization of the design graphics and the product circuit graphics, use a process called photolithography to achieve the above purpose, and then go through a series of subsequent processes. Finally, A ceramic thin film circuit is formed. The photolithography process includes three processes of gluing, photolithography and development. Glue coating is the process of evenly coating a layer of photosensitive insulating resist film on the surface of the metal-plated ceramic chip and pre-baking and curing it. At present, the most widely used gluing method is spin coating, which uses the centrifugal force of...

AI Technical Summary

Problems solved by technology

In the whole photolithography process, glue coating and development use vacuum to clamp ceramic workpieces, but in addition to most ceramic circuits made of non-porous ceramics, there are also some ceramic thin film circuits with metallized holes, because of the openings, The clamping function of the vacuum turntable fails; the development of turntables for foreign equipment has no scalability, and the size of the tiles is agreed upon when purchasing equipment, and the manufacturer customizes the size of the turntable according to the agreed size

In reality, if the size of the tile is larger than the agreed size, it cannot be placed due to the interference of the concentric positioning pins on the turntable, and if the size is smaller than the agreed size, the tile will be thrown away if the vacuum seal is not good in the area beyond the turntable

Foreign manufacturers require that if you have a variety of size requirements, you can customize a variety of turntables to match. The problem is that it is difficult to replace the turntable. The failure of the fastening thread of the turntable will lead to the replacement of the precision stepping motor spindle, which is expensive. Therefore, many manufacturers in the industry do not undertake it. Hole Metallized Thin Film Circuit Tasks

[0003] For the wide application of millimeter-wave ceramic thin-film circuits in military equipment, we have developed a process for preparing ceramic thin-film metallized hole circuits by dry sputtering coating. Through-hole metallized ceramic chips are substrate circuits required by high-end circuits. In the gluing and developing process, the scrap rate of the workpiece on the vacuum turntable remains high. Ceramics with a thickness of 0.254mm-0.127mm are fragile in themselves, and the flexural strength further decreases after drilling. It is more difficult than the conventional process. Through-hole ceramics are covered with a film on the surface to become a vacuum-adsorbable plane, but after the film is pasted, the hole becomes a small "pond"-shaped blind hole. The material in the hole is easy to accumulate and difficult to clean. After the manufacturing process requirements are completed Tear off the film immediately, tearing off the film will cause the excess material in the hole to be carried out, which will pollute the surface of the tile or break the tile

For film processing, users will inevitably have production tasks of other sizes besides the main size. Due to the limitation of the turntable, many tasks are progressing slowly.

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