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Cutting method for multilayer structures containing brittle layers

A technology of multi-layer structure and cutting method, which is applied to glass cutting devices, welding/welding/cutting items, glass manufacturing equipment, etc. It is difficult to improve the cutting quality of the plate and other problems, so as to achieve the effect of good decoration and high cutting quality

Active Publication Date: 2018-08-03
IND TECH RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it is difficult to improve the cutting quality of ultra-thin glass plates because the debris of ultra-thin glass plates cannot be removed by mechanical grinding
Generally speaking, mechanical grinding will break the ultra-thin glass sheet, and any traditional mechanical grinding or advanced ultra-fast laser cutting cannot yet achieve high cutting quality without debris

Method used

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  • Cutting method for multilayer structures containing brittle layers
  • Cutting method for multilayer structures containing brittle layers
  • Cutting method for multilayer structures containing brittle layers

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Embodiment Construction

[0058] figure 1 A schematic diagram showing steps of a cutting method for a multi-layer structure including a brittle layer in an embodiment of the present invention. Please refer to figure 1 , the cutting method of this embodiment includes the following steps. First, step S110 is executed. Step S110 is cutting the multi-layer structure 1 to form a cutting edge E1. In this embodiment, the multilayer structure 1 includes a brittle layer 12 , an adhesive layer 14 and a polymer layer 16 , and the adhesive layer 14 is disposed between the brittle layer 12 and the polymer layer 16 . In this embodiment, for example, the brittle layer 12 is a glass layer, or another material layer mainly composed of silicon dioxide, such as a ceramic layer. In addition, the adhesive layer 14 is, for example, an optical clear adhesive (OCA), and the polymer layer 16 is, for example, polyethylene terephthalate (PET).

[0059] Next, step S120 is executed. Step S120 is to remove the material of the...

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Abstract

A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

Description

technical field [0001] The invention relates to a method for cutting multilayer structures comprising brittle layers. Background technique [0002] Cutting of brittle materials, such as glass, is an important topic in many technological fields, especially in the field of displays or touch panels. In the past, when the thickness of the glass sheet fell in the range of 500 μm to 700 μm, debris caused by cutting the glass sheet could be removed by mechanical grinding. Today, however, glass sheets can be made thinner and thinner to achieve products with curved surfaces, or the glass sheets can be transported in a roll-to-roll manner. [0003] Therefore, the cutting quality of ultra-thin glass sheets becomes very important. However, since the debris of the ultra-thin glass plate cannot be removed by mechanical grinding, it is difficult to improve the cutting quality of the ultra-thin glass plate. Generally speaking, mechanical grinding will break the ultra-thin glass sheet, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402
CPCB23K26/38B23K26/402B23K2103/52B23K2103/54C03B33/0222C03B33/04C03B33/07C03B33/074Y02P40/57
Inventor 邱俊凯谢咏明黄国兴稻山尚利矶本武彦藤居孝英陈长营
Owner IND TECH RES INST