Cutting method for multilayer structures containing brittle layers
A technology of multi-layer structure and cutting method, which is applied to glass cutting devices, welding/welding/cutting items, glass manufacturing equipment, etc. It is difficult to improve the cutting quality of the plate and other problems, so as to achieve the effect of good decoration and high cutting quality
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[0058] figure 1 A schematic diagram showing steps of a cutting method for a multi-layer structure including a brittle layer in an embodiment of the present invention. Please refer to figure 1 , the cutting method of this embodiment includes the following steps. First, step S110 is executed. Step S110 is cutting the multi-layer structure 1 to form a cutting edge E1. In this embodiment, the multilayer structure 1 includes a brittle layer 12 , an adhesive layer 14 and a polymer layer 16 , and the adhesive layer 14 is disposed between the brittle layer 12 and the polymer layer 16 . In this embodiment, for example, the brittle layer 12 is a glass layer, or another material layer mainly composed of silicon dioxide, such as a ceramic layer. In addition, the adhesive layer 14 is, for example, an optical clear adhesive (OCA), and the polymer layer 16 is, for example, polyethylene terephthalate (PET).
[0059] Next, step S120 is executed. Step S120 is to remove the material of the...
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