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Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board

A flexible circuit board and manufacturing method technology, applied in the direction of multilayer circuit manufacturing, printed circuit fillers/particles/fibers/reinforcing materials, etc., can solve problems such as the need to stick tapes, achieve high production efficiency, simple production process, and reduce bias. The effect of bit risk

Inactive Publication Date: 2016-10-12
SHENZHEN KINWONG ELECTRONICS
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a flexible circuit board manufacturing method and a flexible circuit board using ink instead of adhesive tape, aiming to solve the problem that the existing FPC multilayer board manufacturing process needs to be pasted with adhesive tape

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  • Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board

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Embodiment Construction

[0020] The present invention provides a flexible circuit board manufacturing method using ink instead of adhesive tape and a flexible circuit board. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a flexible circuit board manufacturing method using ink instead of tape in the present invention, as shown in the figure, which includes:

[0022] Step S1, performing grinding treatment on the flexible circuit board;

[0023] Step S2, then printing anti-etching ink on the flexible circuit board, and then baking and curing;

[0024] Step S3 , finally stacking boards, rapid pressure or pressure transmission curing, drilling, copper ...

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Abstract

The invention discloses a flexible circuit board manufacturing method and a flexible circuit board using ink instead of adhesive tape. The production method includes the steps: A. grinding the flexible circuit board; B. printing anti-etching ink on the flexible circuit board, and then baking and curing; Holes, copper plating, making outer layer graphics, development, etching and stripping, and post-processing. In the production method of the present invention, the adhesive tape is replaced by ink. After the ink is printed and cured, it can withstand high temperature and high pressure. It can effectively improve the accuracy and reduce the risk of misalignment. It can be directly peeled off in the later stage, which is simple, convenient and fast.

Description

technical field [0001] The invention relates to the field of flexible circuit boards, in particular to a method for manufacturing a flexible circuit board and a flexible circuit board using ink instead of adhesive tape. Background technique [0002] The competition in the flexible circuit board (FPC) industry is becoming more and more fierce, so it also promotes the continuous improvement and optimization of the manufacturing process of flexible circuit boards. In flexible circuit boards, the existing single / double boards cannot meet the needs of the market, so the demand for multi-layer boards is increasing day by day. In the production process of multi-layer boards, high temperature protection tapes are often pasted to protect the inner pads / ground copper skins, etc., but due to their irregular shapes and uneven distribution, this will lead to inconvenient tape application or tape application efficiency. extremely low. In addition, sticking tape will also bring a great h...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/46H05K2201/02
Inventor 吴卫钟邹攀沈雷方董
Owner SHENZHEN KINWONG ELECTRONICS
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