56results about How to "Reduced risk of misalignment" patented technology

A lithium ion battery Z-shaped laminating device and a process thereof are disclosed. That lithium ion battery Z-shaped laminating device comprises a diaphragm, a plurality of negative electrode pieces are uniformly arranged on the upper surface of the diaphragm, and a plurality of positive electrode pieces are arranged on the lower surface of the diaphragm; a hot-pressing compound device; a diaphragm cutting device; a lithium ion battery z-shape lamination process comprise that following steps of: (1) firstly die cutting or cutting the positive electrode roll and the negative electrode roll,then bonding the die-cut or cut negative electrode sheet and the positive electrode sheet on the upper surface and the lower surface of the diaphragm respectively, and performing staggered distribution of the positive electrode sheet and the negative electrode sheet; 2, hot pressing that diaphragm with each negative electrode sheet and the positive electrode sheet; (3) finally, Z-shaped folding and cutting the diaphragm. The invention realizes seamless butt joint between die-cutting or cutting and Z-shaped laminate, eliminates pole piece transfer device and equipment, and uses hot-pressing composite method to fix pole piece, thus reducing the risk of pole piece dislocation in the transfer process of bare cell.

The present invention provides a liquid crystal display module and a liquid crystal display device. The liquid crystal display module comprises: a display panel; a flexible circuit board and an integrated circuit chip, wherein the flexible circuit board comprises a first end and a second end; the first end comprises a second binding terminal; the second binding terminal of the first end is connected to a first binding terminal of a non-display area; the flexible circuit board comprises at least two conductive layers; the flexible circuit board further comprises at least two rows of bonding pads between the first end and the second end; each row of the bonding pads comprises a plurality of sub-bonding pads; the conductive layers are exposed by the sub-bonding pads; the flexible circuit board further comprises a component group; and the integrated circuit chip is electrically connected to the sub-bonding pads through conductive adhesive. The module provided by the invention has the technical effects that the production efficiency can be improved; the cost is reduced; the risk of pressing deviation is reduced; the product yield is increased; the problem that the integrated circuit chip is easy to break is improved; and the package reliability of the integrated circuit chip is increased.

The invention provides a colored color filter which comprises a plurality of repeated pixel units, wherein each pixel unit comprises a plurality of pixels; each pixel includes a subpixel R, a subpixel G and a subpixel B, wherein the subpixel R, the subpixel G and the subpixel B of each pixel are arranged in an L shape or reversed L shape; and a plurality of pixels are arranged in a compensating way, so that the subpixels with the same color can be arranged together.

The invention relates to a sequentially etched and plated lead frame structure without an island prepacked plastic sealed material and a producing method thereof. The structure comprises pins (2), wherein front faces of the pins (2) are plated with first metal layers (5); back faces of the pins (2) are plated with second metal layers (6); etching regions between the pins (2) and the pins (2) are filled with plastic sealed materials (4); and the plastic sealed materials (4) are aligned with the front face and the back face of a metal substrate (9). The sequentially etched and plated lead framestructure provided by the invention has the following advantages: a layer of expensive high temperature resistant soft organic adhesive film needs not to be attached on the bottom of the lead frame; various problems possibly generated in loading, routing and encapsulating are avoided in the background; the yield of the finished products is largely increased; convenience can be brought to the circuit board design while loading is made without a metal island; and the front face and the back face of the lead frame are etched at the same time so that the complicatedness of at least 50% can be reduced in the procedure, the cost is reduced and the malposition risk caused by secondary alignment can be reduced.

The invention discloses a fuel injection system (FS), which comprises an oiling port (20), a pipe joint part (23) and a fuel pipe (50) equipped with a conductive layer for being connected with the pipe joint part (23). The pipe joint part comprises a connection body (25), a disengaging protruding part (26) connected with the outer circumferential surface of the connection body (25) so as to be ring-shaped with the external diameter thereof greater than the inner diameter of the fuel pipe and a grounding connection part (31). The grounding connection part equipped with a fastening part (32) isarranged on the outer circumferential surface of the connection body so as to be protruded with an L-shaped cross-section thereof. An insertion gap (31s) is between the grounding connection part and the outer circumferential surface of the connection body is defined. The fastening part (32) is equipped with a connection protruding part (32b). The end portion of the pipe joint end (51) is allowed to pass through the disengaging protruding part (26). The pipe joint end (51) is pressed to be arranged on the connection body (25) so as to be fit into the insertion gap. Therefore, the connection protruding part is electrically connected with the external layer of the pipe joint end.

The invention discloses a semiconductor device. The semiconductor device includes a substrate; a vertical active area formed on the substrate, wherein the vertical active area includes a first source / drain region, a channel region, and a second source / drain region, and the first source / drain region includes a horizontal extension portion extending out of the active area above the first source / drain region; gate stack formed on an outer periphery of the channel region, wherein the gate stack includes a horizontal extension portion; a stack contract portion from a position above the horizontal extension portion of the first source / drain region to the horizontal extension portion of the first source / drain region, wherein the stack contact portion includes three structures which are vertically and successively arranged; and the three structures include a lower portion, an intermediate portion, and an upper portion, wherein the lower portion at least includes elements identical to elements forming the first source / drain region, the intermediate portion at least includes elements identical to elements forming the channel region, and the upper portion at least includes elements identical to elements forming the second source / drain region.

The invention provides equipment used for conducting positioning and pressure maintaining on an L-shaped part, and belongs to the technical field of pressure maintaining equipment. The equipment comprises a base, a positioning part, a first frame, a first pressing fit part, a second pressing fit part, a second frame, a horizontal segment positioning structure and a vertical segment positioning structure. When the equipment is used for maintaining the pressure of the L-shaped part, part dislocation can be effectively avoided, the quality of the whole product is kept, and meanwhile the mechanismhas the advantage that commissioning is convenient.

The invention discloses a liquid crystal light alignment circuit which comprises a first liquid crystal display panel, a second liquid crystal display panel, a first public electrode, a second public electrode, a third public electrode, a fourth public electrode, a first field effect transistor and a first welding disc, wherein the first public electrode and the second public electrode are connected together and are both connected with the first liquid crystal display panel; the third public electrode and the fourth public electrode are connected together and are both connected with the second liquid crystal display panel; the source area of the first field effect transistor is connected with the second public electrode; the drain area of the first field effect transistor is connected with the third public electrode; the first welding disc is connected with the grid area of the first field effect transistor; when the first public electrode and the first liquid crystal display panel or the fourth public electrode and the second liquid crystal display panel are abnormally connected, the first welding disc can be electrified to communicate the second public electrode with the third public electrode. By adopting the liquid crystal light alignment circuit, normal liquid crystal light alignment voltage can be provided. The invention further discloses a liquid crystal panel.

The invention discloses a flexible circuit board manufacturing method and a flexible circuit board using ink instead of adhesive tape. The production method includes the steps: A. grinding the flexible circuit board; B. printing anti-etching ink on the flexible circuit board, and then baking and curing; Holes, copper plating, making outer layer graphics, development, etching and stripping, and post-processing. In the production method of the present invention, the adhesive tape is replaced by ink. After the ink is printed and cured, it can withstand high temperature and high pressure. It can effectively improve the accuracy and reduce the risk of misalignment. It can be directly peeled off in the later stage, which is simple, convenient and fast.

The invention relates to a sequentially etched and plated lead frame structure with an island prepacked plastic sealed material and a producing method thereof. The structure comprises an island (1) and pins (2), wherein front faces of the island (1) and the pins (2) are plated with first metal layers (5); back faces of the island (1) and the pins (2) are plated with second metal layers (6); etching regions between the island (1) and the pins (2) and between the pin (2) and the pin (2) are all filled with plastic sealed materials (4); and the plastic sealed materials (4) are aligned with the first metal layers (5) and the second metal layers (6). The sequentially etched and plated lead frame structure provided by the invention has the following advantages: a layer of expensive high temperature resistant soft organic adhesive film needs not to be attached on the bottom of the lead frame; various problems possibly generated in loading, routing and encapsulating are avoided in the background; the yield of the finished products is largely increased; and the front face and the back face of the lead frame are etched at the same time so that the complicatedness of at least 50% can be reduced in the procedure, the cost is reduced and the malposition risk caused by secondary alignment can be reduced.

The invention relates to a yarn bobbin package which comprises a plurality of lining plates. The upper surface of each lining plate is provided with a plurality of first grooves, and the lower surface of each lining plate is provided with second grooves which are identical with the first grooves in number and in one-to-one correspondence with the first grooves. The first grooves are communicated with the second grooves in a one-to-one vertical alignment mode. Each lining plate is provided with through holes identical with the first grooves in number. The lining plates are overlapped in sequence, yarn bobbins to be packaged are fixed between every two adjacent lining plates, the upper ends of the yarn bobbins to be packaged are embedded into the second grooves of the upper lining plates, and the lower ends of the yarn bobbins to be packaged are embedded into the first grooves of the lower lining plates, so that the whole package is formed. According to the yarn bobbin package, the defect that in a traditional mode, yarn bobbins collide with one another and consequently the yarn quality is affected due to the fact that the yarn bobbins deviate from positions in the transporting process is overcome; it is ensured that the yarn bobbins are firmly stored in the whole package, the packaging efficiency and the yarn bobbin transporting efficiency are improved, transportation losses are lowered, and the transportation cost is reduced; the yarn bobbin package is simple in structure and low in cost.

The invention discloses an electric connector used for electrically connecting a chip module provided with a plurality of pins. The electric connector is characterized by comprising an insulating bodyand a plurality of terminals, wherein a plurality of accommodating tanks are formed in the insulating body, and an avoiding space is arranged between every two adjacent accommodating tanks so that the accommodating tanks are connected with each other; the terminals are correspondingly accommodated in the accommodating tanks, each terminal comprises a base and two arms formed by extending upwardsfrom the base, the two arms are provided with two clamping parts, two guiding parts formed by bending forwards from the two clamping parts and extending towards the mutually separated direction and aninclined part formed by bending forwards from the base and extending upwards, the front side face of the inclined part is provided with a contact face, the contact face and the two clamping parts areused for clamping the corresponding pin together, the rear side face of the inclined part is provided with a guide face, and the top of the guide face is higher than the bottom face of the avoiding space; when the chip module is installed, for every two adjacent terminals in forward and backward directions, the guide face of the front terminal firstly guides the corresponding pin to be inserted downwards, and then the guide part of the back terminal guides the corresponding pin to move horizontally.

The invention provides an electroacoustic device and electronic equipment adopting the electroacoustic device. The electroacoustic device comprises a vibration system, a magnetic circuit system and abracket system for accommodating the vibration system and the magnetic circuit system, the vibration system comprises a vibrating diaphragm, a middle paster and a voice coil. The magnetic circuit system comprises magnetic steel, a polar plate and a middle hole positioning pin; polar plate on magnetic steel, the polar plate and the magnetic steel are cylindrical; the pole plate and the magnetic steel are coaxial, the support system comprises a support body and a rear cover, the rear cover is fixed to the bottom of the middle of the support body, a first through hole is formed in the middle of the magnetic steel, a second through hole is formed in the middle of the pole plate, the middle hole positioning pin sequentially penetrates through the second through hole and the first through hole and is fixed to the rear cover, and the middle hole positioning pin protrudes out of the pole plate. According to the invention, the problem of interference between the magnetic steel and the voice coil caused by deviation of concentricity of assembly and gluing of the magnetic steel and the bracket during vibration of the vibrating diaphragm can be solved.

The invention discloses an integrated releasing controlling device for a spring ring and a bare stent. The integrated releasing controlling device comprises the spring ring and the bare stent, whereinone end of the spring ring is anchored on the outer surface of the bare stent; the integrated releasing controlling device also comprises a plurality of flexible binding pieces, a first guide wire and a second guide wire, the binding pieces are bent to be in a C shape and used for transversely binding the bare stent on the periphery at intervals, and the two ends of all the binding pieces are sequentially strung through the first guide wire; the second guide wire penetrates through the spring ring in the axial direction of the spring ring and is bound through a fine line. According to the integrated releasing controlling device for the spring ring and the bare stent, it can be effectively avoided that the spring ring and the bare stent are wound in a conveying pin and the positioning releasing process, positioning releasing can be controlled in a multistage mode, and the accuracy is improved; the released spring ring can be wound and shrunk on the periphery of an anchoring area, gapsare accurately blocked off, and the blocking effect of the spring ring is greatly improved.

The invention discloses a hatchback vehicle and a rear cover assembly thereof. The rear cover assembly comprises an inner plate, an outer plate and a cover lock mounting plate, wherein the edges of the inner plate and the outer plate are provided with edge covering structures, and the inner plate and the outer plate are fixedly adhered at the edge covering structures through sealing stripes; the cover lock mounting plate comprises a main body unit and an extension unit, the main body unit is welded to the inner plate, and the extension unit is welded to the outer plate. Therefore, besides the traditional edge covering and adhering structures, the rear cover assembly also obtains the welding structures on the cover lock mounting plate; the cover lock mounting plate achieves indirect connection between the inner plate and the outer plate and improves the connecting structure between the inner plate and the outer plate, thereby reducing the risk of displacement between the inner plate and the outer plate, enhancing the strength of the rear cover assembly and further ensuring the traveling safety of a vehicle.

The present application relates to a gear pairing for a helical gear unit or a spur gear unit, comprising a first gear with a first toothing portion, and a second gear with a second toothing portion,wherein the first gear has a first axis and the second gear has a second axis, which enclose a shaft angle, which is between 0 and 90 degrees, the first toothing portion and the second toothing portion can be brought into meshing engagement and, when engaged, form an involute toothing, the materials of the first and second toothing portions are chosen so that, when engaged, a material pairing metal / plastic results, and the toothing portion made of plastic has a first helix angle and the toothing portion made of metal has a second helix angle. The formula is as shown in the description.

The invention provides a mechanism used for maintaining pressure of an L-shaped part, and belongs to the technical field of pressure maintaining. The mechanism comprises a base, a positioning part, afirst frame, a first pressing fit part, a second pressing fit part and a second frame. When the mechanism is used for maintaining the pressure of the L-shaped part, part dislocation can be effectivelyavoided, the quality of the whole product is kept, and meanwhile the mechanism has the advantage that commissioning is convenient.

The invention discloses batch marking equipment for triangular marks of oil casing pipe screwed joints. The equipment comprises two supporting legs and a transverse rod fixed between the two supporting legs; a plurality of L-shaped pieces are connected onto the transverse rod; one end of each L-shaped piece is in sliding fit with the side surface of the transverse rod, the other end is located above the transverse rod and strides over the transverse rod; the L-shaped pieces can slide along the axis of the transverse rod; the equipment further comprises clamping pieces in sliding fit with the L-shaped pieces; the clamping pieces can slide in the longitudinal direction; the clamping pieces are located below the transverse rod and stride across the transverse rod; cams are arranged below theclamping pieces; the cams are driven by a driving mechanism to rotate; the end, located above the transverse rod, of each L-shaped piece is further provided with a marking assembly. According to the batch marking equipment for the triangular marks of the oil casing pipe screwed joints, the technical problem of low efficiency due to the fact that casing pipes are required to be marked one by one inthe prior art is solved, and the purpose that the triangular marks are printed on a row of laid casing pipes in batches at the same time is achieved.

The invention discloses a liquid crystal light alignment circuit which comprises a first liquid crystal display panel, a second liquid crystal display panel, a first public electrode, a second public electrode, a third public electrode, a fourth public electrode, a first field effect transistor and a first welding disc, wherein the first public electrode and the second public electrode are connected together and are both connected with the first liquid crystal display panel; the third public electrode and the fourth public electrode are connected together and are both connected with the second liquid crystal display panel; the source area of the first field effect transistor is connected with the second public electrode; the drain area of the first field effect transistor is connected with the third public electrode; the first welding disc is connected with the grid area of the first field effect transistor; when the first public electrode and the first liquid crystal display panel or the fourth public electrode and the second liquid crystal display panel are abnormally connected, the first welding disc can be electrified to communicate the second public electrode with the third public electrode. By adopting the liquid crystal light alignment circuit, normal liquid crystal light alignment voltage can be provided. The invention further discloses a liquid crystal panel.

The invention relates to the technical field of display screens, in particular to an image-deformation-preventing spliced display screen which comprises a display screen body, display screen bases are fixedly connected to the back face of the display screen body, fixing bases are fixedly arranged at the corners of the display screen bases, and fastening connecting mechanisms are connected to the fixing bases of the adjacent display screen bases. The fastening connection mechanism is used for fixedly connecting at least two fixing seats of the display screen bases; according to the display screen module panel, the splicing firmness of the adjacent display screen module panels can be improved, the dislocation risk of the display screen module panels can be reduced, and the display screen can normally display images.

The invention relates to a liquid metal conductive glue and its application. The liquid metal conductive adhesive is composed of liquid metal, silver powder and matrix resin, wherein the liquid metal accounts for 25%-81% of the total mass of the conductive adhesive, and the silver powder accounts for 5%-45% of the total mass of the conductive adhesive. The amount is base resin. The liquid metal conductive adhesive has the characteristics of low cost, high conductivity, and high bonding strength, and has good wettability to the battery sheets. As a connecting material for shingled components, it can significantly reduce production costs and the contact between shingled battery sheets. Contact resistance; at the same time, due to the low curing temperature of the liquid metal conductive adhesive, the risk of hidden cracks and fragments of the battery sheet caused by high temperature can be reduced; the cured conductive adhesive has good flexibility, which can absorb the thermal stress of the battery sheet and improve Reliability of shingled components. In addition, the use of the conductive adhesive of the present invention can simplify the connection process of the existing shingling technology, and improve the production efficiency and yield of shingling components.

The present application relates to a gear shaft processing fixture, which relates to the field of gear processing equipment, which includes a workbench and a chuck arranged on the workbench, the chuck is provided with at least two clamping mechanisms, and the The clamping mechanism includes a clamping block, a positioning rod and a stopper for limiting the position of the clamping block, the clamping block and the chuck are slidably connected, the positioning rod and the clamping block connected, the chuck is provided with a positioning hole, the distance between the adjacent clamping blocks is equal, the clamping block is arc-shaped and concentric with the positioning hole, and the The positioning rod faces the axis of the positioning hole. The present application has the effect of reducing the probability of the gear shaft turning during machining.

A gear pair for a helical gear transmission (22), comprising a helical gear (10) with a first toothing segment (12), and a worm (16) with a second toothing segment (18), wherein the first toothing segment (12) and the second toothing segment (18) can be brought into intermeshing and form an involute toothing (26) when intermeshed, the materials of the first and the second toothing segments (12, 18) are chosen such that when intermeshed there results a plastic-metal material pairing, and the toothing segments (12, 18) made of plastic has a first normal tooth thickness (sn1) and the toothing segments (12, 18) made of metal has a second normal tooth thickness (sn2), wherein the ratio of the first normal tooth thickness (sn1) to the second normal tooth thickness is increased by 10 to 200% withrespect to a reference profile.

A method for manufacturing an islandless lead frame structure (100) for semiconductor packaging includes providing a metal substrate, and performing an etching process on the top surface and the back surface of the metal substrate simultaneously using a top surface etching pattern and a back surface etching pattern as the respective masks to form etched regions in the metal substrate and a plurality of leads (2), without forming an island. Further, the method includes placing the etched metal substrate in a mold, and encapsulating the etched metal substrate using the mold such that a molding compound (4) is filled in the etched regions and areas between the plurality of leads (2), while exposing top surfaces and back surfaces of the plurality of leads (2). The method also includes performing a plating process on the encapsulated metal substrate to form a first metal layer (5) on the exposed top surfaces of the plurality of leads (2), and a second metal layer (6) on the exposed back surfaces of the plurality of leads (2).

The invention discloses a positioning system which comprises a product input mechanism, a turntable, a plurality of stations, block positions, a driving motor, at least one position correcting mechanism, a product output mechanism and an automatic control system, wherein the product input mechanism is used for inputting products; the plurality of stations are arranged aside the turntable; the block positions used for placing products are arranged at positions, which are corresponding to the stations, on the turntable; the driving motor is connected to the turntable; the automatic control system is electrically connected to the driving motor, the position correcting mechanism, the product input mechanism and the product output mechanism; the product input mechanism is arranged at an input position aside the turntable and is used for inputting the products into the block positions, and simultaneously, the automatic control system controls the driving motor to drive the turntable to rotate along the radial direction so as to move the products to the next station; the position correcting mechanism is arranged at a correcting position; when marks at preset positions on the surfaces of the products are detected, signals are sent to the automatic control system, and then according to the received signals, the automatic control system controls the driving motor to drive the turntable to rotate along the radial direction so as to move the products to the next station; a holding mechanism which is used for holding or releasing products in the block positions at different stations isarranged on the turntable; and the product output mechanism is arranged at an output position aside the turntable and is used for moving the products in the block positions out of the turntable and outputting the products.