56results about How to "Reduced risk of misalignment" patented technology

The present invention is a balloon catheter used primarily in treatment and surgery for the purpose of dilating lesion sites such as strictures or blockages in passages in the human body. The balloon catheter of the present invention has a structure wherein a guide wire passing tubular member is deployed passing through the interior of the expansion body, and the outer surface of the tubular member and the expansion body are concentrically fused near the distal end of the catheter. This is a balloon catheter that is characterized by the fact that the Shore hardness of the material configuring the outermost surface of the tubular member is smaller than the Shore hardness of the material configuring the expansion body. It is therefore possible to flexibly adjust the tip portion formed by securing the expansion body and the guide wire passing tubular member.

The invention relates to a sequentially etched and plated lead frame structure without an island prepacked plastic sealed material and a producing method thereof. The structure comprises pins (2), wherein front faces of the pins (2) are plated with first metal layers (5); back faces of the pins (2) are plated with second metal layers (6); etching regions between the pins (2) and the pins (2) are filled with plastic sealed materials (4); and the plastic sealed materials (4) are aligned with the front face and the back face of a metal substrate (9). The sequentially etched and plated lead framestructure provided by the invention has the following advantages: a layer of expensive high temperature resistant soft organic adhesive film needs not to be attached on the bottom of the lead frame; various problems possibly generated in loading, routing and encapsulating are avoided in the background; the yield of the finished products is largely increased; convenience can be brought to the circuit board design while loading is made without a metal island; and the front face and the back face of the lead frame are etched at the same time so that the complicatedness of at least 50% can be reduced in the procedure, the cost is reduced and the malposition risk caused by secondary alignment can be reduced.

The invention relates to a sequentially etched and plated lead frame structure with an island prepacked plastic sealed material and a producing method thereof. The structure comprises an island (1) and pins (2), wherein front faces of the island (1) and the pins (2) are plated with first metal layers (5); back faces of the island (1) and the pins (2) are plated with second metal layers (6); etching regions between the island (1) and the pins (2) and between the pin (2) and the pin (2) are all filled with plastic sealed materials (4); and the plastic sealed materials (4) are aligned with the first metal layers (5) and the second metal layers (6). The sequentially etched and plated lead frame structure provided by the invention has the following advantages: a layer of expensive high temperature resistant soft organic adhesive film needs not to be attached on the bottom of the lead frame; various problems possibly generated in loading, routing and encapsulating are avoided in the background; the yield of the finished products is largely increased; and the front face and the back face of the lead frame are etched at the same time so that the complicatedness of at least 50% can be reduced in the procedure, the cost is reduced and the malposition risk caused by secondary alignment can be reduced.

A method for manufacturing an islandless lead frame structure (100) for semiconductor packaging includes providing a metal substrate, forming a first photoresist film on the top surface of the metal substrate, and forming a top surface plating pattern in the first photoresist film using photolithography. The metal also includes performing a plating process on the top surface and the back surface of the metal substrate to form a first metal layer (5) on the top surface and a second metal layer (6) on the back surface. Further, the method includes performing an etching process on the top surface and the back surface of the metal substrate simultaneously using a top surface etching pattern and a back surface etching pattern as the respective masks to form etched regions in the metal substrate and a plurality of leads (2), without forming any island. Further, the method includes removing the third photoresist film and the fourth photoresist film, and pre-encapsulating the etched metal substrate using a molding compound (4) to form the pre-encapsulated lead frame structure.

The invention provides a mechanism used for maintaining pressure of an L-shaped part, and belongs to the technical field of pressure maintaining. The mechanism comprises a base, a positioning part, afirst frame, a first pressing fit part, a second pressing fit part and a second frame. When the mechanism is used for maintaining the pressure of the L-shaped part, part dislocation can be effectivelyavoided, the quality of the whole product is kept, and meanwhile the mechanism has the advantage that commissioning is convenient.

The invention discloses a lithium ion battery zigzag stacking equipment and its technology. The lithium ion battery zigzag stacking equipment includes: a diaphragm, a plurality of negative electrode plates are arranged on the upper surface of the diaphragm at regular intervals, and a plurality of negative electrode plates are arranged on the lower surface of the diaphragm. A positive electrode sheet; a hot-press composite device; a separator cutting device; a lamination mechanism, and the zigzag lamination process of a lithium-ion battery includes the following steps: (1) die-cut or cut the positive roll and the negative roll first, and then place them on the diaphragm The upper surface and the lower surface are respectively bonded with die-cut or cut negative electrode sheets and positive electrode sheets, and the positive electrode sheets and negative electrode sheets are alternately distributed; (2) Then the separator is thermally pressed and composited with each negative electrode sheet and positive electrode sheet; (3 ) and finally carry out zigzag folding and cut the diaphragm. The invention realizes seamless docking between die-cutting or cutting and zigzag laminations, saves the pole piece transfer device and facilities, and fixes the pole piece by hot-compression composite method, which reduces the dislocation of the pole piece during the transfer process of the bare cell risks of.

The invention discloses batch marking equipment for triangular marks of oil casing pipe screwed joints. The equipment comprises two supporting legs and a transverse rod fixed between the two supporting legs; a plurality of L-shaped pieces are connected onto the transverse rod; one end of each L-shaped piece is in sliding fit with the side surface of the transverse rod, the other end is located above the transverse rod and strides over the transverse rod; the L-shaped pieces can slide along the axis of the transverse rod; the equipment further comprises clamping pieces in sliding fit with the L-shaped pieces; the clamping pieces can slide in the longitudinal direction; the clamping pieces are located below the transverse rod and stride across the transverse rod; cams are arranged below theclamping pieces; the cams are driven by a driving mechanism to rotate; the end, located above the transverse rod, of each L-shaped piece is further provided with a marking assembly. According to the batch marking equipment for the triangular marks of the oil casing pipe screwed joints, the technical problem of low efficiency due to the fact that casing pipes are required to be marked one by one inthe prior art is solved, and the purpose that the triangular marks are printed on a row of laid casing pipes in batches at the same time is achieved.

The invention discloses a liquid crystal light alignment circuit which comprises a first liquid crystal display panel, a second liquid crystal display panel, a first public electrode, a second public electrode, a third public electrode, a fourth public electrode, a first field effect transistor and a first welding disc, wherein the first public electrode and the second public electrode are connected together and are both connected with the first liquid crystal display panel; the third public electrode and the fourth public electrode are connected together and are both connected with the second liquid crystal display panel; the source area of the first field effect transistor is connected with the second public electrode; the drain area of the first field effect transistor is connected with the third public electrode; the first welding disc is connected with the grid area of the first field effect transistor; when the first public electrode and the first liquid crystal display panel or the fourth public electrode and the second liquid crystal display panel are abnormally connected, the first welding disc can be electrified to communicate the second public electrode with the third public electrode. By adopting the liquid crystal light alignment circuit, normal liquid crystal light alignment voltage can be provided. The invention further discloses a liquid crystal panel.

The invention relates to a liquid metal conductive glue and its application. The liquid metal conductive adhesive is composed of liquid metal, silver powder and matrix resin, wherein the liquid metal accounts for 25%-81% of the total mass of the conductive adhesive, and the silver powder accounts for 5%-45% of the total mass of the conductive adhesive. The amount is base resin. The liquid metal conductive adhesive has the characteristics of low cost, high conductivity, and high bonding strength, and has good wettability to the battery sheets. As a connecting material for shingled components, it can significantly reduce production costs and the contact between shingled battery sheets. Contact resistance; at the same time, due to the low curing temperature of the liquid metal conductive adhesive, the risk of hidden cracks and fragments of the battery sheet caused by high temperature can be reduced; the cured conductive adhesive has good flexibility, which can absorb the thermal stress of the battery sheet and improve Reliability of shingled components. In addition, the use of the conductive adhesive of the present invention can simplify the connection process of the existing shingling technology, and improve the production efficiency and yield of shingling components.

The present application relates to a gear shaft processing fixture, which relates to the field of gear processing equipment, which includes a workbench and a chuck arranged on the workbench, the chuck is provided with at least two clamping mechanisms, and the The clamping mechanism includes a clamping block, a positioning rod and a stopper for limiting the position of the clamping block, the clamping block and the chuck are slidably connected, the positioning rod and the clamping block connected, the chuck is provided with a positioning hole, the distance between the adjacent clamping blocks is equal, the clamping block is arc-shaped and concentric with the positioning hole, and the The positioning rod faces the axis of the positioning hole. The present application has the effect of reducing the probability of the gear shaft turning during machining.

A gear pair for a helical gear transmission (22), comprising a helical gear (10) with a first toothing segment (12), and a worm (16) with a second toothing segment (18), wherein the first toothing segment (12) and the second toothing segment (18) can be brought into intermeshing and form an involute toothing (26) when intermeshed, the materials of the first and the second toothing segments (12, 18) are chosen such that when intermeshed there results a plastic-metal material pairing, and the toothing segments (12, 18) made of plastic has a first normal tooth thickness (sn1) and the toothing segments (12, 18) made of metal has a second normal tooth thickness (sn2), wherein the ratio of the first normal tooth thickness (sn1) to the second normal tooth thickness is increased by 10 to 200% withrespect to a reference profile.

A method for manufacturing an islandless lead frame structure (100) for semiconductor packaging includes providing a metal substrate, and performing an etching process on the top surface and the back surface of the metal substrate simultaneously using a top surface etching pattern and a back surface etching pattern as the respective masks to form etched regions in the metal substrate and a plurality of leads (2), without forming an island. Further, the method includes placing the etched metal substrate in a mold, and encapsulating the etched metal substrate using the mold such that a molding compound (4) is filled in the etched regions and areas between the plurality of leads (2), while exposing top surfaces and back surfaces of the plurality of leads (2). The method also includes performing a plating process on the encapsulated metal substrate to form a first metal layer (5) on the exposed top surfaces of the plurality of leads (2), and a second metal layer (6) on the exposed back surfaces of the plurality of leads (2).

The invention discloses a positioning system which comprises a product input mechanism, a turntable, a plurality of stations, block positions, a driving motor, at least one position correcting mechanism, a product output mechanism and an automatic control system, wherein the product input mechanism is used for inputting products; the plurality of stations are arranged aside the turntable; the block positions used for placing products are arranged at positions, which are corresponding to the stations, on the turntable; the driving motor is connected to the turntable; the automatic control system is electrically connected to the driving motor, the position correcting mechanism, the product input mechanism and the product output mechanism; the product input mechanism is arranged at an input position aside the turntable and is used for inputting the products into the block positions, and simultaneously, the automatic control system controls the driving motor to drive the turntable to rotate along the radial direction so as to move the products to the next station; the position correcting mechanism is arranged at a correcting position; when marks at preset positions on the surfaces of the products are detected, signals are sent to the automatic control system, and then according to the received signals, the automatic control system controls the driving motor to drive the turntable to rotate along the radial direction so as to move the products to the next station; a holding mechanism which is used for holding or releasing products in the block positions at different stations isarranged on the turntable; and the product output mechanism is arranged at an output position aside the turntable and is used for moving the products in the block positions out of the turntable and outputting the products.