Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof

Abstract

The invention relates to a sequentially etched and plated lead frame structure with an island prepacked plastic sealed material and a producing method thereof. The structure comprises an island (1) and pins (2), wherein front faces of the island (1) and the pins (2) are plated with first metal layers (5); back faces of the island (1) and the pins (2) are plated with second metal layers (6); etching regions between the island (1) and the pins (2) and between the pin (2) and the pin (2) are all filled with plastic sealed materials (4); and the plastic sealed materials (4) are aligned with the first metal layers (5) and the second metal layers (6). The sequentially etched and plated lead frame structure provided by the invention has the following advantages: a layer of expensive high temperature resistant soft organic adhesive film needs not to be attached on the bottom of the lead frame; various problems possibly generated in loading, routing and encapsulating are avoided in the background; the yield of the finished products is largely increased; and the front face and the back face of the lead frame are etched at the same time so that the complicatedness of at least 50% can be reduced in the procedure, the cost is reduced and the malposition risk caused by secondary alignment can be reduced.

Description

Technical field [0001] The invention relates to a lead frame structure and a production method thereof, and belongs to the technical field of semiconductor packaging. Background technique [0002] There are two main traditional lead frame structures: [0003] One is a four-sided flat no-lead package (QFN) lead frame. This structure of the lead frame prevents the plastic material from flashing on the back of the lead frame when the lead frame is being sealed, so it is attached to the back of the lead frame There is a layer of expensive high temperature film (such as Figure 14 As shown), this lead frame structure has the following disadvantages: [0004] 1. A layer of high temperature resistant adhesive film is attached to the bottom of the metal lead frame, which increases the cost of the lead frame by at least 50%; [0005] 2. The adhesive film attached to the bottom of the metal lead frame is a soft organic substance, so in the subsequent packaging process of the mounting and wire b...

AI Technical Summary

Problems solved by technology

[0004] 1. A layer of high temperature resistant adhesive film is attached to the bottom of the metal lead frame, which increases the cost of the lead frame by at least 50%;

[0005] 2. The adhesive film attached to the bottom of the metal lead frame is a soft organic substance, so in the subsequent packaging process of chip loading and wire bonding operations, volatile pollution of organic substances will be generated due to high-temperature baking, which will directly pollute The bonding between the front of the chip and the front of the lead frame and the wire bonding will even affect the failure of the bonding ability with the plastic encapsulant during the subsequent packaging process between the front of the chip and the front of the lead frame (commonly known as delamination);

[0006] 3. Because the soft organic adhesive film is attached to the bottom of the lead frame, part of the bonding force is absorbed by the soft organic adhesive film during the subsequent wire bonding operation in the packaging process, increasing the wire Difficulty in bonding, resulting in instability of wire bonding yield, which may cause reliability problems;

[0007] 4. Because the soft organic adhesive film is attached to the bottom of the lead frame, the metal wire material is limited to soft and expensive gold wire during bonding, instead of hard and low-cost copper and aluminum. quality or other low-cost wire or strip;

[0010] 1. The production process of the lead frame is too complicated, resulting in an increase in the cost of the lead frame;

[0011] 2. The etching of the lead frame is divided into upper and lower etching once, which is easy to cause misalignment due to repeated positioning errors of the upper and lower etching positions

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