Resin composition capable of forming metal circuit

A technology of resin composition and metal circuit, applied in the field of resin composition, can solve the problems of poor processing fluidity, affecting the appearance color of plastic shell, poor whiteness of appearance color, etc., so as to increase quality and pass rate, improve processing The effect of flow and appearance color whiteness

Inactive Publication Date: 2016-10-19
TAIFLEX SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the known laser direct structuring technology, the processing fluidity of the thermoplastic resin is deteriorated due to the addition of laser-activated particles, toners and fillers, so that the known laser direct structuring technology is formed after injection molding The quality or pass rate of the plast

Method used

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  • Resin composition capable of forming metal circuit
  • Resin composition capable of forming metal circuit

Examples

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[0030] In order to have a further understanding and understanding of the purpose, features and effects of the present invention, please follow the accompanying drawings in detail below.

[0031] Please refer to figure 1 , figure 1 It is a schematic diagram of the resin composition capable of forming a metal circuit of the present invention. Such as figure 1 As shown, the resin composition 100 capable of forming metal lines of the present invention includes a thermoplastic polymer resin matrix 110 and a laser direct structuring additive 120. The thermoplastic polymer resin matrix 110 may be formed of polycarbonate (PC) or acrylonitrile-butadiene-styrene (ABS) resin, but the present invention is not limited thereto. The laser direct structuring additive 120 includes a plurality of laser activated particles 122 and is dispersed in the thermoplastic polymer resin matrix 110.

[0032] In the present invention, the laser direct structuring additive 120 may be mixed into the thermoplasti...

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Abstract

A resin composition capable of forming metal circuit includes a thermoplastic polymer resin substrate; and a laser direct structuring additive including a plurality of laser activation particles distributed in the thermoplastic polymer resin substrate; wherein the laser activation particle includes a core portion formed by titanium dioxide, and a cover layer formed by tin oxide and configured to cover a surface of the core portion, a weight percentage of titanium dioxide in the resin composition is x%, a weight percentage of tin oxide in the resin composition is (1-x)%, and 75 < x < 95. In the laser activation particle of the resin composition, the tin oxide is covered on the surface of the core portion formed by the titanium dioxide, and the processing fluidity and the color whiteness of appearance of the laser direct structuring technology are improved. Therefore, the resin composition can increase the product mass and throughout yield of the laser direct structuring technology.

Description

technical field [0001] The present invention relates to a resin composition capable of forming metal circuits, in particular to a resin composition capable of forming metal circuits that can improve the processing fluidity and appearance color whiteness of laser direct molding technology. Background technique [0002] Since electronic products such as smart phones and notebook computers are gradually developing towards thinner, lighter and smaller, it is necessary to reduce the volume or number of components inside the electronic products to increase the application flexibility of the internal space of the electronic products. In order to save the space occupied by some circuit boards in electronic products, a three-dimensional circuit technology has been developed to form metal lines directly on the plastic casing. The biggest advantage of the three-dimensional circuit technology is that it can be used in irregular plastic casings. A three-dimensional circuit is formed on i...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L55/02C08K9/10C08K3/22C08K7/14
Inventor 林杰洪子景高有志
Owner TAIFLEX SCI
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